Ch. 9 - Bonding & Grounding.csv Flashcards Preview

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Flashcards in Ch. 9 - Bonding & Grounding.csv Deck (49):
2

ITS designer responsibility

Safeguarding personnel, property & equipment
(9-2)

3

Results of foreign electrical current

Death or Injury
(9-2)

4

Electrical voltages or currents that are not normally carried by, or expected in, telecommunications dist. systems are referred to as:

Foreign
(9-2)

5

Generally, the establishment of a reference for the electrical power source, the electrical equipment, or both is the definition of:

Grounding (earthing)
(9-4)

6

Bonding is the connection between _____

two metallic items
(9-4)

7

The ITS designer has ______ authority over the ac grounding system.

No
(9-5)

8

In new construction the _________ must provide access.

electrical contractor
(9-6)

9

Telecommunications personnel should not __________.

disconnect ground
(9-6)

10

**Max A/C value on bonding conductor _______ amp.

1 amp
(9-7)

11

Max DC value on a bonding conductor _______ mA's.

500 mA
(9-7)

12

Two point bond test =

earth grounding resistance tester
(9-7)

13

**In TR's, what's the max value for bonding resistance?

0.1 ohms
(9-7)

14

In CO's, what's the max value for bonding resistance?

100 milli-ohms, possibly 50 milli-ohms
(9-7)

15

Impedance of equipment grounding conductor measured with

ground impedance tester
(9-9)

16

*The impedance of the equipment grounding conductor should be:

as low as possible
(9-9)

17

IG-Type (isolated ground) receptacles:

-orange on face
-reduces the effects of EMI and RFI
-not recommended for voice/data
(9-10)

18

Signal reference grid (SRG), how often do you ground it?

-associated with raised floor in an ER
-ground every fourth pedestal
(Figure 9.1 pic on test)
(9-11)

19

ANSI J-STD-607-A

Commercial bldg grounding & bonding requirements for telecommunications.
(9-12)

20

ER & EF's grounding begins?

TMGB
(test)
(9-13)

21

TMGB size =

0.25" x 4"
(9-16)

22

TGB size =

0.25" x 2"
(9-16)

23

Locate the TMGB as close to the ________ as possible.

cable EF
(9-16)

24

At the EF, the TMGB should be placed in close proximity to the:

Entrance conduits
Primary/Secondary surge protection
Cable Sheaths
(9-16)

25

A BCT does what?

grounds the TMGB to the A/C panel w/limit of 30' max
(9-16)

26

TMGB - Primary?
TMGB - Alternative?

1. BCT to A/C panel
2. Nearest structural steel
(9-17)

27

TGB =

ER or TR
0.25" x 2"
(9-18)

28

The bonding infrastructure for the TR will depend on the referencing of its:

TGB
(9-19)

29

TBB =

-between TR's on multiple floors w/ ultimate connection to the EF's TMGB.
-very costly
(9-19)

30

1.Max distance #6 AWG =
2.Over 100' =

1. 100'
2. IAEI / up a size in AWG
(9-20)

31

Typical bonding connections:

Compression type connectors & clamps
Exothermic weld
(9-23)

32

The visual inspection of bonding connections can usually reveal problems such as:

-loose connections
-corrosion
-physical damage
-system modifications
(9-24)

33

Since lightning exposure cannot always be accurately examined, the ITS designer must consider _______ when evaluating a site for exposure.

Standards
Site records
Codes
(9-26)

34

*Inter-building circuits (OSP) are to be considered exposed to lightning unless:

1. metro area (buildings)
2. runs of 140' or less
3. (5) or less storms per year
(9-26)

35

NFPA 780 cover lightning exposure & defines exposed as anything:

Above ground and outside an area under and/or nearly under a lightning protection system.
(9-27)

36

Buries cable can detect ground strikes up to _______.

20'
(9-28)

37

ANSI J/STD-607-A

Bonding & Grounding
(9-31)

38

ANSI/TIA/EIA-568-B.1-2

Commercial building cabling standard
(9-31)

39

IEEE 1100

Recommended practices power & grounding
(9-31)

40

Lightning Protection Institute (LPI)

Publishes material & certifies contractors
(9-32)

41

NFPA 70

Publishes NEC
(9-32)

42

NEC chapter B

Communications systems
(9-32)

43

NEC Article 250

Grounding
(9-32)

44

NFPA 780

Standard for installation of Lightning Protection systems
(9-32)

45

If a raised floor is used within an ER, TR or data processing center; a bonding conductor must be run between the associated grounding busbar and to at least _____ point(s) within the signal reference grid (SRG).

Two
(9-11)

46

The impedance of an electrically conductive path is influenced by:

Inductive & Capacitance???
(9-8)

47

Generally, the connection intended to safely and effectively equalize the potential difference between two metallic items is the definition of:

Bonding
(9-4)

48

The primary purpose of the equipment grounding system is to:

Enhance personnel safety and reduce the likelihood of a fire hazard
(9-8)

49

The grounding (earthing) system that should be in place at every site is the:

Equipment grounding system
Telecommunications bonding infrastructure
ac grounding electrode system
(9-4)

50

What is another function the ITS designer should not do?

Specify separately driven electrodes for referencing telecommunications equipment or busbars.
(??)