Joining and Electronics Manufacturing Flashcards

1
Q

What is Welding

What are the Limitations and Benefits

A

Joining of two or more metal parts, by coalescing them at the contact surfaces with applied heat or pressure

Limitations:
Dangerous (High Energy)
Inconvenient disassembly
Welded joints can have Quality Defects

Advantages:
Mobile (joining can be done in the field)
High Rate of Joining
Small Material Usesage & Fabrication Costs
Economical
Wide Range of Materials

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2
Q

Describe Fusion Welding

What is an Autogenous Weld

What are the benefits to Filler Material

A

Joining Processes that melt base Materials to coalesce parts

A Fusion Weld without Filler Material

Provides, Bulk & Added Strength to the joint

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3
Q

Explain this Process

A

Arc Welding (Fusion)

Electrode Melts surface of the parts to be joined
Melted Metal from both parts join a molten pool
Filler Material is added to Molten Pool
Molten pool cools and Forms a Welded joint

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4
Q

Explain the Defects

A
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5
Q

Describe Solid Sate Welding

Explain the 3 types of Solid State Welding

A

Joining Proceeds that utilises applied pressure to coalesce parts
Can be Just Pressure, or a Combo of Heat (Below Melting point) and Pressure

Diffusion Welding (DFW)-Surfaces held together under pressure at a elevated temperature

Friction Welding (FRW)- Heat of Friction used to join Surfaces

Ultrasonic Welding (USW) - Ultrasonic Oscillating motion in a parallel direction to contact surface , while parts are held under pressure

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6
Q

What are the Hazards of Arc Welding

A

High Temperature of Molten Metals
Flammable fuels (Gas Welding)
High Voltages
UV Radiation Exposure to Eyes (Must Wear Helmet)
Sparks & Molten Splatters
Smoke and Fumes

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7
Q

What are the Processes

A

Spot Welding (Top Left)
Seam Welding (Top RIght)
Flange Weld ( Bottom Left)
Surfacing Weld Bead (Bottom Right)

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8
Q

Explain What has Occured in the HAZ & Recystalisation Zones of the joint

A

Metal has experienced temperatures below melting point
Yet high enough to alter the microstructure of the metal
Religion is Considered Heat Treated
Negative Mechanical Properties
Welding Failures Occur Here

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9
Q

Explain what a Weld Visual Inspection Entails
What are the Limitations

A

Inspector Examines :
Warpage (Conformance to Dimensions )
Cracks
Cavities
Surface Defects
Incomplete Fusion

Limitations:
Only Surface Defects are Examinable
Additional Tests are usually required

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10
Q

Explain 4 Different Methods of Non-Destructive Weld Inspections

A
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10
Q

Explain Mechanical and Metallurgical Weld Inspections (Destructive)

A

Metallurgical - Preparation of specimens to examine microstructure defects and HAZ

Mechanical - Tensile and Shear Tests to test mechanical Properties

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11
Q

What are the Following Mechanical Weld Inspections

A
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11
Q

What are the six major steps to PCB creation

A

Core
Patterning
Vias
Pattern Plating
Solder Mask
Surface Finish

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11
Q

Explain the First Step to PCB Creation

A

Core
Two sheets of copper are laminated to an insulating material

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12
Q

Explain the Second Step to PCB Creation

Explain an alternate Step

A

Patterning
Photomask is Created in a Specific Design
Core is covered in photosensitive material
Core Is exposed to a light Source through the Photomask
Solution applied that develops the photosensitive material
Photosensitive material exposed to light is then rendered soluble and washed off to reveal pattern

Use of a milling machine to mechanically remove copper from core

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13
Q

Explain the Third Step to PCB creation

What is the Aspect Ratio?

A

Vias
Laser or drill bit used to create hole through core
Plate Inner Diameter of hole with deposited Copper (electroplate)
Layers of PCB are now Electrically Connected

Ratio of Depth/Diameter of the Hole
If too large it can cause difficulties in electroplating (4-6 typically)

14
Q

Explain the fourth Step to PCB Creation

A

Pattern Plating

Secondary copper plating process
Treatments are applied to boards surface to clean copper layer (Degreasing, Microetching and Acid Pickling)
PCB core acts as an electrode in electroplating process
Thickness of Copper is Increased through Reduction of Copper ions on Surface
a layer of tin is deposited as an etching resist
tin protects the desired copper traces
Unwanted Copper is then Removed

15
Q

Explain the fifth Step to PCB Creation

A

Solder Mask
Polymer layer applied using silk screening or spray-on
Insulating Green layer that protects Copper from Oxidation
Covers all conducting circuits other then the pads.

16
Q

Explain the Sixth Step to PCB Creation

A

Surface Finish
Pads of a PCB Board are coated with a conducting metal
This is so the copper can resist oxidation
and the board is prepared for the application of solder

17
Q
A