MOD 1.1 QUIZ

Question 1

What are the 3 Core Parts of a Computing Device?

Answer 1

1. Processor
2. Memory
3. Input-Output

Question 2

What are the design considerations?

Answer 2

1. Performance (Faster)
2. Cost (Higher)

Question 3

What is Response Time?

Answer 3

Time spent to complete an event

Question 4

What are synonyms of Response Time?

Answer 4

Execution Time or Latency

Question 5

What is Throughput?

Answer 5

Amount of work done in a given time

Question 6

True or False:
Is faster response time means an improvement in throughput?

Answer 6

Yes, faster response time means improvement in throughput

Question 7

What are inversely proportional

Answer 7

Execution time and Performance are inversely proportional

Question 8

What is the formula of Execution time and Performance?

Answer 8

n = Px/Py = ty/tx

Machine X is n times faster than Y means

Question 9

What is the rule of thumb in computer design?

Answer 9

Optimize frequent cases

Question 10

What are purposeful devices?

Answer 10

-Wearable
-Power-efficient
-Powerful Processing
-Video Processing
-Gaming

Question 11

What is Amdahl’s Law?

Answer 11

The performance improvement to be gained by using some faster mode of execution is limited by the fraction of the time the faster mode can be used

Question 12

What is the formula for Amdahl’s Law?

Answer 12

Speedup = 1/(1-f)+(f/N)

Question 13

Amdahl’s Law & Parallel Computing

Answer 13

-Improvement limited by sequential portion (cannot be done in parallel)
-Parallel portion (Multiple CPUs, Servers, etc)
-Speedup based on constant workload

Question 14

What is Moore’s Law?

Answer 14

Number of transistors in a chip doubles every 18-24 months

Question 15

How is Cost-Sensitive design best measured?

Answer 15

By change in yield (percentage of manufactured products that survives quality control)

Question 16

True or False:

Manufacturing Costs does NOT equate to Product Price

Answer 16

True

Question 17

What is the formula for the Cost of Die?

Answer 17

Cost of Die = Wafer Cost/Dies per Wafer x Die Yield

Question 18

What is the Simplified Manufacturing Process?

Answer 18

1 Silicon Ingot
2 Slicer
3 Blank Wafers
4 20 to 40 processing steps
5 Patterned Wafers
6 Wafer Tester
7 Tested Wafer
8 Dicer
9 Tested Dies
9 Bond die to package
10 Packaged Dies
11 Part Tester
12 Tested Packaged Dies
13 Ship to Customers

Question 19

What are the other costs for Integrated Circuits (IC)?

Answer 19

• Die cost
• Packaging
• Testing
• Yield

Question 20

What is the formula for IC Cost?

Answer 20

IC Cost = Die Cost + Testing Cost + Packaging Cost / Final Test Yield