Chapter 3: Reliabilty Allocation and Software Reliability Flashcards

(77 cards)

1
Q

What is reliability allocation

A

It is a process of assigning reliability requirements to individual components for achieving specified system reliability. It is a process of assigning reliability values to subsections of a system and these add up to become the reliability of the entire system.

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2
Q

What are the benefits of reliability allocation

A

It forces people involved in design to understand and establish appropriate relationships between reliabilities of components and parts. It forces engineers to consider reliability equally with other design parameters such as cost, performance, weight, etc.

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3
Q

What are the most common methods of reliability allocation

A

Hybrid, Similar Familiar Systems Method, Factor of Influence Method

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4
Q

What is the similar familiar system Method of reliability allocation

A

This method makes use of failure data collected on a similar system and subsystems.

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5
Q

What is the major disadvantage of the similar familiar method of reliability allocation

A

It assumes that the life cycle, cost, and reliability of past similar designs were satisfactory.

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6
Q

What is the Factors of Influence method for Reliability Allocation

A

It is based on the assumption that factors such as failure criticality, environment, complexity & time, and state of the art affect the system’s reliability.

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7
Q

How does the factor of influence method work?

A

Each item is evaluated with respect to each of the four factors on a scale of 1-10. 10 means the item is most affected, 1 means least affected.

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8
Q

What is failure criticality

A

This factor considers the criticality of failure in the item on the system.

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9
Q

What is the environment factor

A

This accounts for the item’s exposure or susceptibility to environmental conditions such as vibration, temperature, and humidity.

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10
Q

What is the Complexity and time factor

A

Relates to the number of subsystem parts and the relative operating time of the item during the functional period of the system.

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11
Q

What is the state of the art factor

A

Takes into account the advancement in the state of the art at a given time.

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12
Q

How does the Hybrid reliability allocation work

A

Combines the similar familiar systems and the factor of influence methods by assigning weights to both.

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13
Q

What are the major classifications of failure in electronic systems?

A

Load exceeding rated or derated values under transient, steady-state or test conditions, and non-load related factors.

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14
Q

What is the MIL-HDBK-217 standard

A

A standard for reliability prediction in electronic systems providing failure rate models for electronic components.

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15
Q

What are the main features and assumptions of MIL-HDBK-217

A

The system is repairable, component failures contribute to system failure rate, and failure times are independent and exponentially distributed.

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16
Q

What is the general failure rate model given by MIL-HDBK-217

A

λp = λb * πQ * πE * πA (base failure rate, quality factor, environment factor, application factor)

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17
Q

What is the base failure rate of an electrical component

A

Related to temperature and based on diffusion reaction rates governed by the Arrhenius equation.

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18
Q

What is the formula for the Arrhenius equation

A

R(s) = e^{-lamda * t}

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19
Q

What’s the difference between the failure in mechanical and electrical systems

A

Mechanical systems wear out; electrical systems do not wear out in the same sense.

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20
Q

What are the stress and non stress factors that can cause failure in electrical components

A

Parameter drift, transient, electromigration, electromagnetic interference.

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21
Q

What are Transient electrical stresses

A

Short duration high voltages or currents affecting delicate electrical components.

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22
Q

What are the causes of transient electrical stresses

A

Capacitive/inductive effects, ESD, lightning, switching transients.

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23
Q

What type of transients are lower power diodes vulnerable to

A

Transients

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24
Q

What are metal oxides vulnerable to

A

ESD

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25
What are methods of protecting against transient voltages
Buffering, Clamping, Current limiting, Opto-coupling
26
How does buffering work
Connecting capacitors between ground and voltage line; capacitors absorb high-frequency transients.
27
How does clamping work
Connecting a diode between power supply and a line to prevent voltage from rising above a fixed value.
28
How does current limiting work
Connecting a current limiting resistor, particularly to protect a transistor junction.
29
How does opto coupling work
This is a combination of light emitting diode and optical transducers transmits signal to iste sensitive portions of electrical systems from dangerous transients
30
What is the effect of excessive heat on an electrical component
There is no guarantee that the component will be operating within the manufacturers specifications
31
What are the methods of reducing excessive heating of electrical components
Mounting the device on a heat sink, thermal conduction plane, connection of fans to improve air circulation in enclosure, ensuring layout and orientation of components are such that hot components are placed downstream in the heat flow paths and PCBs are aligned vertically to enhance convective airflow liquid cooling for high power devices that give off high amounts of heat.
32
How does a heat sink work
It is a metal block with fins to aid dissipation, convection and radiant heat. It is particularly used for power transistors and high speed ICs.
33
What is Electromigration
This is the bulk movement of aluminium conductor track material due to electron flow
34
How does electromigration come about
Overtime, high current densities in thin film conductors on IC's can cause voids(Internal open circuits) or hillocks.
35
How can electromigration be prevented
Limiting the current density and operating temperature, Adequate quality control production stage.
36
What is component parameter drift
This is a situation where electrical components drift from their specified values as a result of temperature, long time usage etc.
37
Give examples of a Parameter Drift in a component
38
Parameters drift with age depends on what and what
Type of materials, instruction used, operating temperature and time.
39
What is the consequences of parameter drift on electrical components
They cause circuits to work incorrectly in service
40
Why is there a need for tolerance design
As a result of parameter drift of components and devices
41
What does Tolerance design entail
Evaluation of the effects of parameter drift in yield stability and reliability by identifying the parameters (and their values) that are most likely to affect the performance most and determining the extent of variation of all important parameter values.
42
What is EMI
Electromagnetic interference is any unwanted radiation that can cause interference to an electrical system itself or to other systems
43
What are the entities involved in EMI
THe source-The emitter of EMI unintentionally or intentionally, The Victim-the device that is susceptible to EM energy emitted by the source and the COupling Path-means r mechanism through which EM energy is transferred from source to destination
44
What are the two classes of EMI
Natural or man made
45
Give examples of natural EMI
electric storms cosmic interference, lightining and precipitation static.
46
How can natural interference be Minimizes
directional antennas, proper equipment grounding, effective frequency management.
47
Give examples of man made EMI
electric motors, generators, lamps, relays, automotive ignition(spark plugs)high frequency radiation from fast digital circuits and power circuits
48
What are the methods used to protect against or limit EMI susceptibility usually called
Electromagnetic Compatibility
49
List the EMC methods
Screening, filtering, Isolation by opto couplers, circuit design, using coding method to software driven systems, proper selection of switches, relays and other make or break circuit components, provision of balanced circuit impedances.
50
How does screening perform EMC
By enclosing circuits in grounded and conductive boxes or by providing grounded conductive screens for cables or by using twisted pair arrangement
51
Give examples of where EMI triumphs
Airplanes, Pacemakers
52
What is SCA
Sneak Circuit Analysis are circuits that help to identify unexpected functions to the system or constrain expected functions in electrical/electronic systems
53
What are the types of sneak circuits
Sneak Paths, Sneak opens, Sneak timing, Sneak indications, Sneak Labels
54
What are sneak paths
Current flows along and unexpected route in a circuit
55
What is sneak opens
Current does not flow along and expected route
56
What is sneak timing
Current does not flow at the correct time or flows at an incorrect time
57
What are sneak indications
False or ambiguous indications
58
What are sneak labels
False,ambiguous or incomplete labels on controls or indicators
59
What is WCA
Worst case analysis is aimed at analyzing the overall parameters of the system when the component parameters of the system is worst (i.e lowest and highest tolerance values)
60
What is stress DErating
It is a method of limiting the stresses (e.g temperature, pressure, current voltage) which should be applied to a component to stress levels below the specified maxima in order to enhance reliability
61
What is the formula for stress DErating
Stress Derating = (Applied Stress) / (Rated Maximum Stress)
62
What are the differences between software and hardware
Software is a developed or engineered product while hardware is a manufactured physical product, Software does not enter the wear out phase while hardware does, A soft ware error exists in all copies of the program Hence the scope of software error is large since software program consists of many individual statements and logical paths
63
Why are software costs concentrated in the engineering phase of production
Good software can only be achieved through good design.
64
How does the failure rate of software vary with time
The hazard rate function can show an initial decline and tends to follow the useful life trend. Change to the program can cause spikes at the time of intervention.
65
What are software reliability models usually formulated from
Random processes
66
What is the major difference between software models
The nature of variation of random processes
67
What are the factors that software failure rate models usually depends on
Fault introduction (Which depends on the characteristics of the developed ode), Fault removal (Which depends on the characteristics of developed code), The environment (Which depends on the operational profile)
68
What are the characteristics of a good software reliability model
Simplicity, Cost, Capability, Predictive Validity, Quality of Assumptions
69
What does capability as a characteristic of a good software model mean
The software model must have the ability to accurately predict and the required reliability measures such as MTTF, failure intensity and mean failure rate
70
What does predictive validity as a characteristic of a good software model mean
The software model must have the capability to predict future failure behaviour from the past and present.
71
What does quality of assumption as a characteristic of a good software model mean
Any assumptions used in the model should be plausible from an evaluation point of view by being logically consistent.
72
What is the execution time component model
This model is based on the non-homogeneus process assumption in which the probability distribution used vary with time
73
What ate the two forms of the execution time component model
Basic execution time model and logarithm Poisson model
74
What is the formula for the basic execution time model
μ(t) = V₀ * (1 - e^(-λ₀ * t))
75
What is the slope of the basic execution time model
Slope = -λ₀ / V₀
76
What is the formula for the logarithmic poission model
μ(t) = β * ln(1 + λ * t)
77
What is the slope of the logarithmic poission model
Slope = λ / (1 + λ * t)