Flashcards in Chapter 19 Deck (20):
What is a non-traditional process? Why need it. (3)
processes that do not use a cutting tool.
for hard to machine metals and non-metals.
No surf damage
Explain Ultrasonic Machining. What for? (3)
slurry with abrasives. tool vibrate. Fed slowly. Shape of tool.
hard brittle work. And ss and ti
shapes non-round and along curved axis.
Water jet Cutting. What for? (3). Benefits (4)
high p and v water.
Narrow slits in flat stock.
NOT brittle material
no crush or burning.
min material loss
Abrasive water jet cutting (3). What for?
wjc with abrasives ranging 60 to 120.
Made from alumina, SiO2, garnet
Mass flow = 0.25 kg/min
Deburring, trimming, polishing
hard brittle material and thin flat stock
What are the adv(4)/disadv(4) of Water jet machining
work any hardness
no thermal stresses
nozzle life short
high cap cost of equip
Abrasive flow machining. What for (2)
Viscoelastic polymer (putty) with abrasive
Deburring and polishing difficult to reach areas (passageways)
reverse electroplating. Corrosion.
ECM, ECD. ECG
Electrochemical machining. Tool material. what for? (3)
anodic dissolution and electrode.Deplates work. Tool: cu, brass, ss
multiple hole drilling (nonround holes)
removes burrs or sharp corners
what for (2)
conductive bond material corrodes metal part surface
sharpening cemented carbide tools
grinding fragile parts
deplating 95% metal removal
grinding wheel lasts longer
thermal energy processes problems
since removed from fusion or vaporization there is physical and metallurgical damage to work surface. bad finish
Electric discharge machining
work materials (3)
shape of work made by shape of electrode tool.
requires dielectric fluid.
electrically conducting work
any hardness and strength of work
mrr depends on tm of work
what for? (2)
fed slowly. constant diameter. dielectric required with nozzles at interface.
stamping die components
intricate outline shapes like lathe form tools, extrusion dies, and flat templates
electron beam machining
what for (3)
electrons at 75% c to melt in very localized area
reduce diameter by 0.025 mm
drilling holes with high depth to diameter ratios of 100:1
no stresses imposed
fast drilling speed and precision
little material wasted with kerf
need skilled labor
need good backing material
max thick 10 mm
capital equip high
laser beam machining
what for (4)
monochromatic (single wave length)
highly collimated (light rays are almost perfectly parallel)
high power densities
drilling, slitting, slotting, scribing, marking
0.025 diam holes
used on thin stock
for high hardness and strength, soft metals, ceramics, glass....
steps in chemical machining (4)
masking: maskant chemically resistant
factors that determine Etchant
depth and mrr
surface finish requirement
process of chemical milling
clean raw part
scribe, cut, peel maskant