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Flashcards in acc Deck (1190):
1

AMHS

Automated Material Handling System - used to automatically transport lots from bay to bay or tool to tool.

2

Assembly

The final stage of semiconductor manufacturing in which the wafer is divided into individual units (chips) and placed in a protective package. Steps include probing, dicing, die attach, wire bonding, encapsulation and final test.

3

Back End Manufacturing

The portion of semiconductor manufacturing that happens after the wafer has left the clean room. This includes testing the chips at wafer level, repairing the chips if necessary, dicing the wafers and putting the individual chips into packages. In short,

4

Back End Of Line processes, BEOL

Operations performed on the semiconductor wafer in the course of device manufacturing following first metallization.

5

Back-End-Of-Line

Acronym: BEOL; the back end is considered to be all of the process steps from contact through the completion of the wafer prior to electrical test and probe.

6

Boat

A quartz or Teflon structure that holds wafers during transport or processing. Quartz boats are used for processes that require excessive heat because they can withstand the heat and will not contaminate the wafers from melting or changing characteristics

7

Booties

Shoes worn in the Fab.

8

Bucket Report

Reports that is used by the mfg to monitor required equipment capacity

9

Carts

A small wheeled vehicle used to move and temporarily hold component and module lots.

10

Cassette

An open-carrier that holds wafers.

11

CBT

Computer Based Training

12

Cell

A tiny area within the memory array that stores a bit. A cell is actually a small capacitor that stores a bit in the form of a charge.

13

Cell

Established locations in the manufacturing area where similar machines reside.

14

Certification

The achievement of a level of competency on a specific piece of equipment or specific operation.

15

CH

Change Management

16

Chamber

Short for vacuum chamber: a cavity within equipment such as an implanter which resides with reduced pressure and which usually has a specific function, such as the end station or target chamber.

17

CIM

Computer Integrated Manufacturing.

18

CimAssign

Comprises of optimization rule, dispatch rules, sampling rules and assignment rules. Used in 300mm to assign lots to tools.

19

CimCentral

Generic application interface to modify databases. Applications such as Recipe Manager, Limits Manager, Template Manager and CIMConfig are built on top of the CIMCentral generic interface using CIM GUI Builder

20

CimOne

A window application which provides a one-stop interface for fab users to start, retrieve and check lots

21

Cleanroom

The super clean environment in which semiconductors are manufactured. The lower the rating, the cleaner the facility. These rooms typically have hundreds of thousands of particles less per cubic foot than the environment.

22

Contaminant

Foreign material, such as fibers, hair, plastic, etc. that inhibit the end function of a PCA (Printed Circuit Assembly).

23

Contamination

A general term used to describe anything on a PCB (Printed Circuit Board) or component that is not supposed to be there at that point in the process. (e.g., particles, dirt, fingerprints, etc).

24

Cycle purge

To flow high volume of gas and then pump down for a few times (after PM) to get rid of particle.

25

Cycle time

The amount of time it take to process a lot(s) from one step to another.

26

Cycletime

Time taken from start-end.

27

Defect

A flaw in/on a wafer or die, which is an unacceptable condition that does not meet the customer's manufacturing requirements. Any deviation from the normally accepted characteristics of product or component.

28

Delete Step

A CIMOne transaction which skips the lot from the current step to the proceeding step.

29

Documentum

A computer library where documents (such as procedures) are stored.

30

DOE

An acronym for Design of Experiments. Design of Experiment methods are used to improve and optimize processes.

31

DPM

Defects Per Million.

32

DPW

Die Per Wafer.

33

DQDR

Deviation Quality Deviation Report

34

DRAM

Dynamic Random Access Memory. A type of memory component used to store information in a computer system. 'Dynamic' means the DRAMs need a constant 'refresh' (pulse of current through all of the memory cells) to keep the stored information.

35

EMO

Emergency Off Switch.

36

EMO

Emergency Machine Off

37

End user

The ultimate user of the product. The end users of Micron's memory systems are banks, schools, hospitals, etc.

38

Engineering change notice

(ECN) A notification of a change made to inform everyone involved of a change and how it will affect their area.

39

engineering files

Files that ware created at runtime to store engineering data of each process run.

40

Engineering Work

Corrective maintenance work that is performed on AMHS components

41

ERT

Emergency Response Team. A specially-trained team of people who respond to emergencies.

42

ESD

Electrostatic Discharge, The dissipation of electricity. (In layman's terms, a "shock.") ESD can easily destroy semiconductor products, even when the discharge is too small to be felt.

43

ET

Equipment Tracking

44

ETA

Estimated Time of Arrival.

45

ETI

Equipment Tracking Interface: A computer program used for logging equipment to different stages of operation.

46

Event

A particular step in a process on the coat or develop tracks.

47

Fab

(FABrication) The production area of the company where integrated circuitry (die) are formed on bare silicon wafers through various layer formations. The four areas of processing in the Fab are Diffusion, Photo, Etch, and Implant.

48

Fab Out

Wafers finished processing in Fab and passed over to Test.

49

FABNAV

Data Navigator (Software)

50

Feedback control

Control strategy which is based on the result of the previous run to modify the next run to have better performance.

51

FEOL

Front End-of-Line: the portion of the DRAM fabrication process from blanket silicon to the formation and isolation of the transistors. See also: MOL (Middle-of-Line) and BEOL (Back End-of-Line).

52

FIFO

First In First Out. A process that ensures that older material is used or inspected first.

53

Flipper

This device uses vacuum to grasp the substrate, flips it, and then places it on the saw chuck table. (A Singulation term in Assembly).

54

FMEA

The acronym for Failure Mode and Effect Analysis, a systematic, structured approach to process improvement in the design and process development stage.

55

FOSB

Front Opening Shipping Box - A container used to ship 300 mm wafers.

56

FOUP

Front Opening Unified Pod - A container used to hold and protect up to 25 300mm wafers during storage and transport.

57

Front End Manufacturing

This refers to wafer processing that takes place in the clean room, as opposed to processing that happens after the wafer has been essentially finished. Once the wafer is done with its clean room processing it moves into the back end manufacturing, which

58

Front End Of Line processes, FEOL 

Operations performed on the semiconductor wafer in the course of device manufacturing up to first metallization.

59

GERM

Generic Recipe Manager (GeRM) The Generic Recipe Manager is an engineering software program and database that is used for manufacturing automation. The GeRM program stores recipe information. The program also allows inserting, updating, deleting, and view

60

Gigabyte

GB,gig: This refers to approximately one billion bytes. To be specific, it is 2^30, or 1,073,741,824 bytes.

61

Gripper

In Assembly Trim/Form. A Dusan onload specific device that transports individual leadframes from a magazine to the onload track assembly by way of mechanical or vacuum operation.

62

GDM

GeRM Deviation Management

63

GUI

Graphical User Interface

64

Hazard warning

Any words, picture, symbol, or combination thereof that conveys the hazard of the toxic substance in the container.

65

Hazardous Waste

Any waste material that is deemed unsafe for humans or the environment and requires special disposal procedures.

66

Hot lot

A lot that has priority over other lots in the line and should be processed as soon as possible. Most hot lots will be 'yellow striped,' or some will have 'hot' written on the traveler or lot box.

67

Hold

A process used to set lots aside to be reviewed by a member of leadership, engineering, members of the EDS group, or other support groups.

68

Hold Lots

Lots put on hold for FA (Failure Analysis) or Engineering due to a deviation.

69

I/O port

Connection to a CPU that is configured or programmed to provide data path between the CPU and external devices such as a keyboard, display, or reader; it may be an input port or an output port, or it may be bi-directional.

70

IC

1) Inventory Control 2) Integrated circuit. A tiny complex of electronic components and their connections that is produced in or on a small slice of material (such as silicon).

71

Idle

A piece of equipment not in use.

72

IMFT

Intel/Micron Flash Technologies. IM Flash Technologies is a joint venture between Micron and Intel to manufacture NAND flash memory. See the IMFT website at www.imftech.com.

73

IPQ

Ideal Production Quantity

74

IPR

Initial Production Run.

75

IQ

No of days to complete qual

76

ISO

International Standards Organization.

77

Jigs

A device used to position and hold parts for machining operations and to guide the cutting tool.

78

Kit

A collection of all materials and documentation necessary to complete a production job.

79

Laser scribe

A unique 4 digit mark placed on a component at the assembly step. The scribe identifies the lot from which the component originated.

80

Layout

The screen that shows the arrangement of sections on the machine.

81

LDI

Lot Dispatch Interface

82

LIFO

Last In First Out.

83

Line

Entire process flow.

84

Line yield

The cumulative (overall) yields through all operations of any manufacturing area.

85

LL

Load Lock

86

LLM

Load Lock Module

87

Loadlock

Vacuum chambers, located on either side of the main reaction chamber, which enable the main chamber to remain at a constant vacuum status.

88

Lockout/Tagout

The physical restraint of all hazardous energy sources that supply power to a piece of equipment, machinery or system.

89

Lot

A group of wafers that travels through the processing as a unit in a box marked with an assigned number.

90

Lot Aborted

Lot does not successfully completed process, aka BATCH_ABORT received by host.

91

Lot Committed

Lot track-in to a step upon all carrier objects of a batch are created successfully on the equipment, before PJ and CJ are created.

92

Lot Filter

A field within Factory Works that it utilized to assign and identify different attributes.

93

Lot History

In Factory Works and MAM, Lot History contains a list of activities that have occurred for the lot.

94

Lot ID

A unique number assigned to each direct material inventory based on purchase order number. In Factory Works, a work order in progress.

95

Lot number

A unique number assigned to each direct material inventory based on purchase order number. In Factory Works, a work order in progress.

96

Lot Processed

Lot completed process in equipment, aka BATCH_END event received by host.

97

Lot Running

Lot started processing in equipment, aka BATCH_START event received by host.

98

Lot Staged

Lot staged to an equipment using CimOne300 GUI.

99

Lot traveler

A tag that identifies the lot. Lot travelers travel with the lot through all steps in the area and list the current step and information for the lot.

100

Lot Type

Used to differentiate between Eng/Production/Qual lots.

101

Lot-Ordering

An interface in CimOne GUI for operator to pre-select lot at upstream process step to run at specified downstream process step.

102

LotView

An interface in CIMOne GUI which displays a list of dispatched lots to a specified equipment.

103

LP

Loading Port

104

LPRO

Low Pressure Oxide

105

LPRO Manager

CimCentral application which is used to control the lot to be processed in the online equipments for limited process only

106

Mainframe

Refer to tools that have chambers.

107

Manual mode

In this mode, the machine does not run from a bond program. Manual mode is used to teach master bond parameters that will be used when a bond program is taught in edit mode. Manual mode is used when you need to manually enter information or bond.

108

Manual Port

Input and output ports accessed by operators

109

Manufacturing execution system

A system used to track the execution of the process of manufacturing a semiconductor

110

Material safety data sheet

MSDS, a sheet required by OSHA, and published by the material manufacturer, that provides all of the pertinent information about the safety, health and physical hazards of the substance and how to respond to emergency sit-uations involving exposure to the

111

MATREQ

MATerials REQuisition: A computer program used to request materials.

112

MDM

Micron Document Manager

113

Merge

In Factory Works/SIMS/MAM, this function allows several lots to be combined into a larger lot.

114

MPD

Micron Passdown

115

MT_Groups

Micron Technology Groups

116

MTTF

Mean Time To Failure.

117

MTTR

Mean Time To Repair.

118

MTTR

Mean time to recovery

119

MTTR

Mean Time to Recovery

120

Nand

* A type of flash architecture with the memory array accessed in a vertical manner. Commonly used as storage medium in digital cameras, MP3 players, etc. * Not AND.A Boolean operation which is true unless both of its inputs are true.Another way of

121

Nanotechnology

Nanotechnology: The prefix nano means a billionth. Nanotechnology deals with various structures of matter having dimensions of the order of a billionth of a meter. In the semiconductor industry, it is a branch of engineering that deals with the design of

122

OCM

Outlook Calendar Manager

123

OEM

Acronym for: Original Equipment Manufacturer.

124

Offline

Unable to communicate with host

125

Offline GUI

An interface for operator to enter data to feed machine process data to SMS template, LotViewer and LotHist and perform a manual logout the lot from the current logpoint/Operation. Available on 200mm only

126

OLUS

Operator Load Unload Station - used to dispatch lots for processing and sending lots on after processing.

127

Online-Local

Able to communicate with host, but not able to accept remote commands from host

128

Online-Remote

Able to accept remote commands from host

129

Purchase order

(PO) A customer's commitment to buy goods or services from a supplier.

130

QDR

(Quality Deviation Report) - A report attached to a lot that has deviated from the normal process or that is not within specifications.

131

QDRS

Quality Deviation Report Summary

132

Qual

(Qualification)- the process of checking machine functioning to make ready for product. (Qualification) - The process of checking machines to ensure that they are ready to run product.

133

Qual lot

An experimental lot.

134

Qual lot

Qualification Lot. Lots that are run through a leak test to ensure that machinery in other areas is grounded properly.

135

Qual State

The machine MES state where qual is done.

136

Queue Time

Maximum limit of waiting time after the last processing step to the next step, generally set base on yield loss or inline changes established with the waiting time (equivalent to Time Window in TECH's term).

137

R&D

Research and Development. A department that researches and develops Microns' parts.

138

Radio Frequency Identification (RFID)

A system that consists of a transponder or "tag" {small silicon chips that contain identifying data} and a "reader" that automatically receives and decodes the data on the tag. RFID systems operate in both low frequency {less than 100 megahertz} and high

139

RAM

Random Access Memory. RAM packs millions of data-storing electrical circuits onto a small chip. Devices can write to and read from these storage locations, and the CPU uses this memory to hold programs and data.

140

Ramp up

A gradual consistent increase in production in one or all departments of the company.

141

Range

The difference between the smallest and largest values in a set of data. This is the simplest measure of variation.

142

Reliability

An index of the capability of a device, circuit or system to perform properly for its intended life in its intended environment; continued conformance to specification.

143

Robot arm

A robotic arm that moves the wafers on the tapers, detapers, and ADE.

144

Robot end effecters

The end of the robot arm that holds the wafer.

145

Runahead lot

A lot that runs ahead of of the rest of the product to see if there are any problems in the process line.

146

SAM

The Setup@Micron (SAM) web site provides one central location to view currently installed programs, install workgroup programs - programs used by members in your work area, uninstall programs, search for other programs, and access more information for a p

147

Scanner

1) A machine used to check lead coplinarity. 2) Used to read barcodes and enter the information into an application.

148

Scanner

A laser scanner on the tapers and detapers mounted to the robot arm. It scans the load boats, counts the wafers, determines the position of the wafers, and checks for any cross-slotting.

149

Scrap

* Parts that have failed all tests and are therefore disposed at a low value. * Product that is scrapped falls out of a tracking system. This does not necessarily mean the product is to be ôthrown awayö. Often components that are ôscrappedö in MAM

150

Screamer lot

Priority lot

151

Scribe

A marking on a wafer that identifies the wafer and the lot it came from. The scribe is located on the front of the wafer, opposite the major flat.

152

SEM

Scanning Electron Microscope: is the best known and most widely-used of the surface analytical techniques. High resolution images of surface topography, with excellent depth of field are produced using a highly-focused, scanning (primary) electron beam. T

153

Semiconductor

* A class of materials, such as silicon and germanium, whose electrical properties lie between those of conductors (such as copper and aluminum) and insulators (such as glass and rubber). * A material that exhibits relatively high resistance in a

154

Shift

SPC (Statistical Process Control) term that indicates the process has changed suddenly and is detected by eight consecutive points falling on the same side of the process center line (above or below the mean).

155

Sigma Data Collector

The Sigma Data Collector program is the front-end interface for the Sigma system. This program is used to collect data from existing manufacturing runs, and then send that data to other systems such as MTSPC or MES. The data collected by the Sigma Data Co

156

Sigma Specs

The name of the data collection plan in Sigma.

157

Simga History

Allows viewing of all completed Sigma run historical data using the Sigma History program. The Sigma Data Collector program collects and stores data from Sigma at the completion of a run process. The Sigma History program is the interface used to search f

158

SOP

Standard Operating Procedure.

159

SPC

Statistical Process Control: The use of statistics to determine uniformity around a target value.

160

Stage

The initial step to every process flow. Staging a lot is to assign a lot to the respective equipment (load-port) which the lot will be processed.

161

Staging

On Test Floor, the process of choosing lots according to priority and placing them at each position on the Test Floor in order to keep each system operating with little or no downtime.

162

Status

Indicates if the specific piece of equipment is idle or Busy.

163

STB

Short Term Bonus

164

Step

An operation within the process flow.

165

Stocker

Storage module of AMHS system

166

Stockers

Automated storage units for wafers when they are not being processed.

167

SWR

Special Work Request. Organized by Engineering and used to perform experimental procedures on specific lots as a means to find ways to improve the product. An SWR attached to the lot details what changes are necessary.

168

System

A group of machines combined to operate together, or any tester/handler combination.

169

Targets

A term used to refer to wafers that have been exposed and developed so that alignment and exposure can be checked.

170

TBD

To Be Determined. Used on quotes in reference to shipping dates.

171

TW

Test Wafer

172

User Acceptance Test

The process of testing and verification of the behavior/results of an application code or configuration change. The user who requested for a change or a new development will need to signoff the UAT as passed before the change is promoted to priction statu

173

Utilization

Actual wafer move in a given time.

174

Vacuum

A low-pressure condition.

175

Vehicle

The transport unit for OHS and OHT

176

Wafer

A round slice of silicon on which integrated circuits are constructed; usually anywhere from 75 mm (3") to 300 mm (12")in diameter. Also referred to as substrate.

177

Wafer

Sometimes called a slice. A wafer is a thin, single-crystalline material used to manufacture integrated circuits. Wafers are sliced from a long cylinder of material called a boule. In its pure form, the boule is non-conducting; it is only after it is dope

178

Wafer fab

Site where integrated circuits or devices are manufactured.

179

Wafer fabrication

Process of manufacturing wafers.

180

Wafer ID Selection

To manually select additional wafer ID to be processed other than the pre-selected wafers in GeRM.

181

Wafer map

A wafer map is generated when the dice on a wafer are tested in Probe. This wafer map is sent to a data base in the Vax and is called up by the die attach machine to identify which dice are to be picked for Assembly or die sales.

182

Wafer Scribe

The seven digit number located on the wafer where designated in the Fab. The first number represents the Fab area in which it was processed, the next four digits is the lot number, the last two digits is the wafer number.

183

Wafer sort

The step after wafer fabrication during which the integrated circuits are tested for functionality. Probes contact the pads of the circuit to conduct the test-leading to the name "prober". The equipment that performs electrical tests on each die site of c

184

WIP

Work In Process, starts as Pre-WIP and processed through all the requires steps to Finished Goods.

185

Wip Summary

Reports that is used by the mfg to monitor the Wip movement of the flow

186

Work Constraint report

Reports that is used by the mfg to monitor the most constrained workstation in the fab based on the rank of the workstation. This indicates the amount of time (in days) required to clear out inventory at that workstaion.

187

Work Order

The workflow in the SAP PM module that monitors and tracks the step by step process of carrying out a maintenance on a production equipment. The Work Order is used mainly to trigger and account for materials required for a maintenace job.

188

WW

Work Week: Micron's work week begins Friday morning and ends on Thursday evening.

189

WW

Workweek

190

Yield

The percent of wafers, dice, or packaged units conforming to specifications. The most common yields in the manufacturing process are: wafer fab yield (percentage of the wafers that complete wafer processing); wafer probe yield (the fraction of dice on a w

191

Term

Definition

192

AMAT

Applied Materials

193

AMHS

Automated Material Handling System - used to automatically transport lots from bay to bay or tool to tool.

194

Area

In Factory Works, this identifies a location where the lot is available and ready to be dispatched to specific piece of equipment. EXAMPLE: TEST, MARK/SCAN/Packaging, and Burn.

195

Arms

The moving parts of the taper, detaper, and grinder that handle the wafers or tape.

196

Assembly

The final stage of semiconductor manufacturing in which the wafer is divided into individual units (chips) and placed in a protective package. Steps include probing, dicing, die attach, wire bonding, encapsulation and final test.

197

Auto-Auto Operation

Auto Staging by CIMAssign/CIMStage and Auto Delivery of Lots by AMHS for 300mm operations

198

Back End Manufacturing

The portion of semiconductor manufacturing that happens after the wafer has left the clean room. This includes testing the chips at wafer level, repairing the chips if necessary, dicing the wafers and putting the individual chips into packages. In short,

199

Back End Of Line processes, BEOL

Operations performed on the semiconductor wafer in the course of device manufacturing following first metallization.

200

Back out

A packaged lot or group of packaged lots that have been issued back to Post Electrical from Finished Goods.

201

Back up Lot

A lot that is precounted and ready for test.

202

Backend

The production from Assembly to Shipping.

203

Back-End-Of-Line

Acronym: BEOL; the back end is considered to be all of the process steps from contact through the completion of the wafer prior to electrical test and probe.

204

Batch

A unique identifier for one or more lots that process together in a equipment.

205

Batch

Group of wafers processed together.

206

Boat

A quartz or Teflon structure that holds wafers during transport or processing. Quartz boats are used for processes that require excessive heat because they can withstand the heat and will not contaminate the wafers from melting or changing characteristics

207

Booties

Shoes worn in the Fab.

208

Bucket Report

Reports that is used by the mfg to monitor required equipment capacity

209

Carts

A small wheeled vehicle used to move and temporarily hold component and module lots.

210

Cassette

An open-carrier that holds wafers.

211

CBT

Computer Based Training

212

Cell

A tiny area within the memory array that stores a bit. A cell is actually a small capacitor that stores a bit in the form of a charge.

213

Cell

Established locations in the manufacturing area where similar machines reside.

214

Certification

The achievement of a level of competency on a specific piece of equipment or specific operation.

215

CH

Change Management

216

Chamber

Short for vacuum chamber: a cavity within equipment such as an implanter which resides with reduced pressure and which usually has a specific function, such as the end station or target chamber.

217

CIM

Computer Integrated Manufacturing.

218

CimAssign

Comprises of optimization rule, dispatch rules, sampling rules and assignment rules. Used in 300mm to assign lots to tools.

219

CimCentral

Generic application interface to modify databases. Applications such as Recipe Manager, Limits Manager, Template Manager and CIMConfig are built on top of the CIMCentral generic interface using CIM GUI Builder

220

CimOne

A window application which provides a one-stop interface for fab users to start, retrieve and check lots

221

Cleanroom

The super clean environment in which semiconductors are manufactured. The lower the rating, the cleaner the facility. These rooms typically have hundreds of thousands of particles less per cubic foot than the environment.

222

Contaminant

Foreign material, such as fibers, hair, plastic, etc. that inhibit the end function of a PCA (Printed Circuit Assembly).

223

Contamination

A general term used to describe anything on a PCB (Printed Circuit Board) or component that is not supposed to be there at that point in the process. (e.g., particles, dirt, fingerprints, etc).

224

Cycle purge

To flow high volume of gas and then pump down for a few times (after PM) to get rid of particle.

225

Cycle time

The amount of time it take to process a lot(s) from one step to another.

226

Cycletime

Time taken from start-end.

227

Defect

A flaw in/on a wafer or die, which is an unacceptable condition that does not meet the customer's manufacturing requirements. Any deviation from the normally accepted characteristics of product or component.

228

Delete Step

A CIMOne transaction which skips the lot from the current step to the proceeding step.

229

Documentum

A computer library where documents (such as procedures) are stored.

230

DOE

An acronym for Design of Experiments. Design of Experiment methods are used to improve and optimize processes.

231

DPM

Defects Per Million.

232

DPW

Die Per Wafer.

233

DQDR

Deviation Quality Deviation Report

234

DRAM

Dynamic Random Access Memory. A type of memory component used to store information in a computer system. 'Dynamic' means the DRAMs need a constant 'refresh' (pulse of current through all of the memory cells) to keep the stored information.

235

EMO

Emergency Off Switch.

236

EMO

Emergency Machine Off

237

End user

The ultimate user of the product. The end users of Micron's memory systems are banks, schools, hospitals, etc.

238

Engineering change notice

(ECN) A notification of a change made to inform everyone involved of a change and how it will affect their area.

239

engineering files

Files that ware created at runtime to store engineering data of each process run.

240

Engineering Work

Corrective maintenance work that is performed on AMHS components

241

ERT

Emergency Response Team. A specially-trained team of people who respond to emergencies.

242

ESD

Electrostatic Discharge, The dissipation of electricity. (In layman's terms, a "shock.") ESD can easily destroy semiconductor products, even when the discharge is too small to be felt.

243

ET

Equipment Tracking

244

ETA

Estimated Time of Arrival.

245

ETI

Equipment Tracking Interface: A computer program used for logging equipment to different stages of operation.

246

Event

A particular step in a process on the coat or develop tracks.

247

Fab

(FABrication) The production area of the company where integrated circuitry (die) are formed on bare silicon wafers through various layer formations. The four areas of processing in the Fab are Diffusion, Photo, Etch, and Implant.

248

Fab Out

Wafers finished processing in Fab and passed over to Test.

249

FABNAV

Data Navigator (Software)

250

Feedback control

Control strategy which is based on the result of the previous run to modify the next run to have better performance.

251

FEOL

Front End-of-Line: the portion of the DRAM fabrication process from blanket silicon to the formation and isolation of the transistors. See also: MOL (Middle-of-Line) and BEOL (Back End-of-Line).

252

FIFO

First In First Out. A process that ensures that older material is used or inspected first.

253

Flipper

This device uses vacuum to grasp the substrate, flips it, and then places it on the saw chuck table. (A Singulation term in Assembly).

254

FMEA

The acronym for Failure Mode and Effect Analysis, a systematic, structured approach to process improvement in the design and process development stage.

255

FOSB

Front Opening Shipping Box - A container used to ship 300 mm wafers.

256

FOUP

Front Opening Unified Pod - A container used to hold and protect up to 25 300mm wafers during storage and transport.

257

Front End Manufacturing

This refers to wafer processing that takes place in the clean room, as opposed to processing that happens after the wafer has been essentially finished. Once the wafer is done with its clean room processing it moves into the back end manufacturing, which

258

Front End Of Line processes, FEOL 

Operations performed on the semiconductor wafer in the course of device manufacturing up to first metallization.

259

GERM

Generic Recipe Manager (GeRM) The Generic Recipe Manager is an engineering software program and database that is used for manufacturing automation. The GeRM program stores recipe information. The program also allows inserting, updating, deleting, and view

260

Gigabyte

GB,gig: This refers to approximately one billion bytes. To be specific, it is 2^30, or 1,073,741,824 bytes.

261

Gripper

In Assembly Trim/Form. A Dusan onload specific device that transports individual leadframes from a magazine to the onload track assembly by way of mechanical or vacuum operation.

262

GDM

GeRM Deviation Management

263

GUI

Graphical User Interface

264

Hazard warning

Any words, picture, symbol, or combination thereof that conveys the hazard of the toxic substance in the container.

265

Hazardous Waste

Any waste material that is deemed unsafe for humans or the environment and requires special disposal procedures.

266

Hot lot

A lot that has priority over other lots in the line and should be processed as soon as possible. Most hot lots will be 'yellow striped,' or some will have 'hot' written on the traveler or lot box.

267

Hold

A process used to set lots aside to be reviewed by a member of leadership, engineering, members of the EDS group, or other support groups.

268

Hold Lots

Lots put on hold for FA (Failure Analysis) or Engineering due to a deviation.

269

I/O port

Connection to a CPU that is configured or programmed to provide data path between the CPU and external devices such as a keyboard, display, or reader; it may be an input port or an output port, or it may be bi-directional.

270

IC

1) Inventory Control 2) Integrated circuit. A tiny complex of electronic components and their connections that is produced in or on a small slice of material (such as silicon).

271

Idle

A piece of equipment not in use.

272

IMFT

Intel/Micron Flash Technologies. IM Flash Technologies is a joint venture between Micron and Intel to manufacture NAND flash memory. See the IMFT website at www.imftech.com.

273

IPQ

Ideal Production Quantity

274

IPR

Initial Production Run.

275

IQ

No of days to complete qual

276

ISO

International Standards Organization.

277

Jigs

A device used to position and hold parts for machining operations and to guide the cutting tool.

278

Kit

A collection of all materials and documentation necessary to complete a production job.

279

Laser scribe

A unique 4 digit mark placed on a component at the assembly step. The scribe identifies the lot from which the component originated.

280

Layout

The screen that shows the arrangement of sections on the machine.

281

LDI

Lot Dispatch Interface

282

LIFO

Last In First Out.

283

Line

Entire process flow.

284

Line yield

The cumulative (overall) yields through all operations of any manufacturing area.

285

LL

Load Lock

286

LLM

Load Lock Module

287

Loadlock

Vacuum chambers, located on either side of the main reaction chamber, which enable the main chamber to remain at a constant vacuum status.

288

Lockout/Tagout

The physical restraint of all hazardous energy sources that supply power to a piece of equipment, machinery or system.

289

Lot

A group of wafers that travels through the processing as a unit in a box marked with an assigned number.

290

Lot Aborted

Lot does not successfully completed process, aka BATCH_ABORT received by host.

291

Lot Committed

Lot track-in to a step upon all carrier objects of a batch are created successfully on the equipment, before PJ and CJ are created.

292

Lot Filter

A field within Factory Works that it utilized to assign and identify different attributes.

293

Lot History

In Factory Works and MAM, Lot History contains a list of activities that have occurred for the lot.

294

Lot ID

A unique number assigned to each direct material inventory based on purchase order number. In Factory Works, a work order in progress.

295

Lot number

A unique number assigned to each direct material inventory based on purchase order number. In Factory Works, a work order in progress.

296

Lot Processed

Lot completed process in equipment, aka BATCH_END event received by host.

297

Lot Running

Lot started processing in equipment, aka BATCH_START event received by host.

298

Lot Staged

Lot staged to an equipment using CimOne300 GUI.

299

Lot traveler

A tag that identifies the lot. Lot travelers travel with the lot through all steps in the area and list the current step and information for the lot.

300

Lot Type

Used to differentiate between Eng/Production/Qual lots.

301

Lot-Ordering

An interface in CimOne GUI for operator to pre-select lot at upstream process step to run at specified downstream process step.

302

LotView

An interface in CIMOne GUI which displays a list of dispatched lots to a specified equipment.

303

LP

Loading Port

304

LPRO

Low Pressure Oxide

305

LPRO Manager

CimCentral application which is used to control the lot to be processed in the online equipments for limited process only

306

Mainframe

Refer to tools that have chambers.

307

Manual mode

In this mode, the machine does not run from a bond program. Manual mode is used to teach master bond parameters that will be used when a bond program is taught in edit mode. Manual mode is used when you need to manually enter information or bond.

308

Manual Port

Input and output ports accessed by operators

309

Manufacturing execution system

A system used to track the execution of the process of manufacturing a semiconductor

310

Material safety data sheet

MSDS, a sheet required by OSHA, and published by the material manufacturer, that provides all of the pertinent information about the safety, health and physical hazards of the substance and how to respond to emergency sit-uations involving exposure to the

311

MATREQ

MATerials REQuisition: A computer program used to request materials.

312

MDM

Micron Document Manager

313

Merge

In Factory Works/SIMS/MAM, this function allows several lots to be combined into a larger lot.

314

MPD

Micron Passdown

315

MT_Groups

Micron Technology Groups

316

MTTF

Mean Time To Failure.

317

MTTR

Mean Time To Repair.

318

MTTR

Mean time to recovery

319

MTTR

Mean Time to Recovery

320

Nand

* A type of flash architecture with the memory array accessed in a vertical manner. Commonly used as storage medium in digital cameras, MP3 players, etc. * Not AND.A Boolean operation which is true unless both of its inputs are true.Another way of

321

Nanotechnology

Nanotechnology: The prefix nano means a billionth. Nanotechnology deals with various structures of matter having dimensions of the order of a billionth of a meter. In the semiconductor industry, it is a branch of engineering that deals with the design of

322

OCM

Outlook Calendar Manager

323

OEM

Acronym for: Original Equipment Manufacturer.

324

Offline

Unable to communicate with host

325

Offline GUI

An interface for operator to enter data to feed machine process data to SMS template, LotViewer and LotHist and perform a manual logout the lot from the current logpoint/Operation. Available on 200mm only

326

OLUS

Operator Load Unload Station - used to dispatch lots for processing and sending lots on after processing.

327

Online-Local

Able to communicate with host, but not able to accept remote commands from host

328

Online-Remote

Able to accept remote commands from host

329

Purchase order

(PO) A customer's commitment to buy goods or services from a supplier.

330

QDR

(Quality Deviation Report) - A report attached to a lot that has deviated from the normal process or that is not within specifications.

331

QDRS

Quality Deviation Report Summary

332

Qual

(Qualification)- the process of checking machine functioning to make ready for product. (Qualification) - The process of checking machines to ensure that they are ready to run product.

333

Qual lot

An experimental lot.

334

Qual lot

Qualification Lot. Lots that are run through a leak test to ensure that machinery in other areas is grounded properly.

335

Qual State

The machine MES state where qual is done.

336

Queue Time

Maximum limit of waiting time after the last processing step to the next step, generally set base on yield loss or inline changes established with the waiting time (equivalent to Time Window in TECH's term).

337

R&D

Research and Development. A department that researches and develops Microns' parts.

338

Radio Frequency Identification (RFID)

A system that consists of a transponder or "tag" {small silicon chips that contain identifying data} and a "reader" that automatically receives and decodes the data on the tag. RFID systems operate in both low frequency {less than 100 megahertz} and high

339

RAM

Random Access Memory. RAM packs millions of data-storing electrical circuits onto a small chip. Devices can write to and read from these storage locations, and the CPU uses this memory to hold programs and data.

340

Ramp up

A gradual consistent increase in production in one or all departments of the company.

341

Range

The difference between the smallest and largest values in a set of data. This is the simplest measure of variation.

342

Reliability

An index of the capability of a device, circuit or system to perform properly for its intended life in its intended environment; continued conformance to specification.

343

Robot arm

A robotic arm that moves the wafers on the tapers, detapers, and ADE.

344

Robot end effecters

The end of the robot arm that holds the wafer.

345

Runahead lot

A lot that runs ahead of of the rest of the product to see if there are any problems in the process line.

346

SAM

The Setup@Micron (SAM) web site provides one central location to view currently installed programs, install workgroup programs - programs used by members in your work area, uninstall programs, search for other programs, and access more information for a p

347

Scanner

1) A machine used to check lead coplinarity. 2) Used to read barcodes and enter the information into an application.

348

Scanner

A laser scanner on the tapers and detapers mounted to the robot arm. It scans the load boats, counts the wafers, determines the position of the wafers, and checks for any cross-slotting.

349

Scrap

* Parts that have failed all tests and are therefore disposed at a low value. * Product that is scrapped falls out of a tracking system. This does not necessarily mean the product is to be ôthrown awayö. Often components that are ôscrappedö in MAM

350

Screamer lot

Priority lot

351

Scribe

A marking on a wafer that identifies the wafer and the lot it came from. The scribe is located on the front of the wafer, opposite the major flat.

352

SEM

Scanning Electron Microscope: is the best known and most widely-used of the surface analytical techniques. High resolution images of surface topography, with excellent depth of field are produced using a highly-focused, scanning (primary) electron beam. T

353

Semiconductor

* A class of materials, such as silicon and germanium, whose electrical properties lie between those of conductors (such as copper and aluminum) and insulators (such as glass and rubber). * A material that exhibits relatively high resistance in a

354

Shift

SPC (Statistical Process Control) term that indicates the process has changed suddenly and is detected by eight consecutive points falling on the same side of the process center line (above or below the mean).

355

Sigma Data Collector

The Sigma Data Collector program is the front-end interface for the Sigma system. This program is used to collect data from existing manufacturing runs, and then send that data to other systems such as MTSPC or MES. The data collected by the Sigma Data Co

356

Sigma Specs

The name of the data collection plan in Sigma.

357

Simga History

Allows viewing of all completed Sigma run historical data using the Sigma History program. The Sigma Data Collector program collects and stores data from Sigma at the completion of a run process. The Sigma History program is the interface used to search f

358

SOP

Standard Operating Procedure.

359

SPC

Statistical Process Control: The use of statistics to determine uniformity around a target value.

360

Stage

The initial step to every process flow. Staging a lot is to assign a lot to the respective equipment (load-port) which the lot will be processed.

361

Staging

On Test Floor, the process of choosing lots according to priority and placing them at each position on the Test Floor in order to keep each system operating with little or no downtime.

362

Status

Indicates if the specific piece of equipment is idle or Busy.

363

STB

Short Term Bonus

364

Step

An operation within the process flow.

365

Stocker

Storage module of AMHS system

366

Stockers

Automated storage units for wafers when they are not being processed.

367

SWR

Special Work Request. Organized by Engineering and used to perform experimental procedures on specific lots as a means to find ways to improve the product. An SWR attached to the lot details what changes are necessary.

368

System

A group of machines combined to operate together, or any tester/handler combination.

369

Targets

A term used to refer to wafers that have been exposed and developed so that alignment and exposure can be checked.

370

TBD

To Be Determined. Used on quotes in reference to shipping dates.

371

TW

Test Wafer

372

User Acceptance Test

The process of testing and verification of the behavior/results of an application code or configuration change. The user who requested for a change or a new development will need to signoff the UAT as passed before the change is promoted to priction statu

373

Utilization

Actual wafer move in a given time.

374

Vacuum

A low-pressure condition.

375

Vehicle

The transport unit for OHS and OHT

376

Wafer

A round slice of silicon on which integrated circuits are constructed; usually anywhere from 75 mm (3") to 300 mm (12")in diameter. Also referred to as substrate.

377

Wafer

Sometimes called a slice. A wafer is a thin, single-crystalline material used to manufacture integrated circuits. Wafers are sliced from a long cylinder of material called a boule. In its pure form, the boule is non-conducting; it is only after it is dope

378

Wafer fab

Site where integrated circuits or devices are manufactured.

379

Wafer fabrication

Process of manufacturing wafers.

380

Wafer ID Selection

To manually select additional wafer ID to be processed other than the pre-selected wafers in GeRM.

381

Wafer map

A wafer map is generated when the dice on a wafer are tested in Probe. This wafer map is sent to a data base in the Vax and is called up by the die attach machine to identify which dice are to be picked for Assembly or die sales.

382

Wafer Scribe

The seven digit number located on the wafer where designated in the Fab. The first number represents the Fab area in which it was processed, the next four digits is the lot number, the last two digits is the wafer number.

383

Wafer sort

The step after wafer fabrication during which the integrated circuits are tested for functionality. Probes contact the pads of the circuit to conduct the test-leading to the name "prober". The equipment that performs electrical tests on each die site of c

384

WIP

Work In Process, starts as Pre-WIP and processed through all the requires steps to Finished Goods.

385

Wip Summary

Reports that is used by the mfg to monitor the Wip movement of the flow

386

Work Constraint report

Reports that is used by the mfg to monitor the most constrained workstation in the fab based on the rank of the workstation. This indicates the amount of time (in days) required to clear out inventory at that workstaion.

387

Work Order

The workflow in the SAP PM module that monitors and tracks the step by step process of carrying out a maintenance on a production equipment. The Work Order is used mainly to trigger and account for materials required for a maintenace job.

388

WW

Work Week: Micron's work week begins Friday morning and ends on Thursday evening.

389

WW

Workweek

390

Yield

The percent of wafers, dice, or packaged units conforming to specifications. The most common yields in the manufacturing process are: wafer fab yield (percentage of the wafers that complete wafer processing); wafer probe yield (the fraction of dice on a w

391

Term

Definition

392

AMAT

Applied Materials

393

AMHS

Automated Material Handling System - used to automatically transport lots from bay to bay or tool to tool.

394

Area

In Factory Works, this identifies a location where the lot is available and ready to be dispatched to specific piece of equipment. EXAMPLE: TEST, MARK/SCAN/Packaging, and Burn.

395

Arms

The moving parts of the taper, detaper, and grinder that handle the wafers or tape.

396

Assembly

The final stage of semiconductor manufacturing in which the wafer is divided into individual units (chips) and placed in a protective package. Steps include probing, dicing, die attach, wire bonding, encapsulation and final test.

397

Auto-Auto Operation

Auto Staging by CIMAssign/CIMStage and Auto Delivery of Lots by AMHS for 300mm operations

398

Back End Manufacturing

The portion of semiconductor manufacturing that happens after the wafer has left the clean room. This includes testing the chips at wafer level, repairing the chips if necessary, dicing the wafers and putting the individual chips into packages. In short,

399

Back End Of Line processes, BEOL

Operations performed on the semiconductor wafer in the course of device manufacturing following first metallization.

400

Back out

A packaged lot or group of packaged lots that have been issued back to Post Electrical from Finished Goods.

401

Back up Lot

A lot that is precounted and ready for test.

402

Backend

The production from Assembly to Shipping.

403

Back-End-Of-Line

Acronym: BEOL; the back end is considered to be all of the process steps from contact through the completion of the wafer prior to electrical test and probe.

404

Batch

A unique identifier for one or more lots that process together in a equipment.

405

Batch

Group of wafers processed together.

406

Boat

A quartz or Teflon structure that holds wafers during transport or processing. Quartz boats are used for processes that require excessive heat because they can withstand the heat and will not contaminate the wafers from melting or changing characteristics

407

Booties

Shoes worn in the Fab.

408

Bucket Report

Reports that is used by the mfg to monitor required equipment capacity

409

Carts

A small wheeled vehicle used to move and temporarily hold component and module lots.

410

Cassette

An open-carrier that holds wafers.

411

CBT

Computer Based Training

412

Cell

A tiny area within the memory array that stores a bit. A cell is actually a small capacitor that stores a bit in the form of a charge.

413

Cell

Established locations in the manufacturing area where similar machines reside.

414

Certification

The achievement of a level of competency on a specific piece of equipment or specific operation.

415

CH

Change Management

416

Chamber

Short for vacuum chamber: a cavity within equipment such as an implanter which resides with reduced pressure and which usually has a specific function, such as the end station or target chamber.

417

CIM

Computer Integrated Manufacturing.

418

CimAssign

Comprises of optimization rule, dispatch rules, sampling rules and assignment rules. Used in 300mm to assign lots to tools.

419

CimCentral

Generic application interface to modify databases. Applications such as Recipe Manager, Limits Manager, Template Manager and CIMConfig are built on top of the CIMCentral generic interface using CIM GUI Builder

420

CimOne

A window application which provides a one-stop interface for fab users to start, retrieve and check lots

421

Cleanroom

The super clean environment in which semiconductors are manufactured. The lower the rating, the cleaner the facility. These rooms typically have hundreds of thousands of particles less per cubic foot than the environment.

422

Contaminant

Foreign material, such as fibers, hair, plastic, etc. that inhibit the end function of a PCA (Printed Circuit Assembly).

423

Contamination

A general term used to describe anything on a PCB (Printed Circuit Board) or component that is not supposed to be there at that point in the process. (e.g., particles, dirt, fingerprints, etc).

424

Cycle purge

To flow high volume of gas and then pump down for a few times (after PM) to get rid of particle.

425

Cycle time

The amount of time it take to process a lot(s) from one step to another.

426

Cycletime

Time taken from start-end.

427

Defect

A flaw in/on a wafer or die, which is an unacceptable condition that does not meet the customer's manufacturing requirements. Any deviation from the normally accepted characteristics of product or component.

428

Delete Step

A CIMOne transaction which skips the lot from the current step to the proceeding step.

429

Documentum

A computer library where documents (such as procedures) are stored.

430

DOE

An acronym for Design of Experiments. Design of Experiment methods are used to improve and optimize processes.

431

DPM

Defects Per Million.

432

DPW

Die Per Wafer.

433

DQDR

Deviation Quality Deviation Report

434

DRAM

Dynamic Random Access Memory. A type of memory component used to store information in a computer system. 'Dynamic' means the DRAMs need a constant 'refresh' (pulse of current through all of the memory cells) to keep the stored information.

435

EMO

Emergency Off Switch.

436

EMO

Emergency Machine Off

437

End user

The ultimate user of the product. The end users of Micron's memory systems are banks, schools, hospitals, etc.

438

Engineering change notice

(ECN) A notification of a change made to inform everyone involved of a change and how it will affect their area.

439

engineering files

Files that ware created at runtime to store engineering data of each process run.

440

Engineering Work

Corrective maintenance work that is performed on AMHS components

441

ERT

Emergency Response Team. A specially-trained team of people who respond to emergencies.

442

ESD

Electrostatic Discharge, The dissipation of electricity. (In layman's terms, a "shock.") ESD can easily destroy semiconductor products, even when the discharge is too small to be felt.

443

ET

Equipment Tracking

444

ETA

Estimated Time of Arrival.

445

ETI

Equipment Tracking Interface: A computer program used for logging equipment to different stages of operation.

446

Event

A particular step in a process on the coat or develop tracks.

447

Fab

(FABrication) The production area of the company where integrated circuitry (die) are formed on bare silicon wafers through various layer formations. The four areas of processing in the Fab are Diffusion, Photo, Etch, and Implant.

448

Fab Out

Wafers finished processing in Fab and passed over to Test.

449

FABNAV

Data Navigator (Software)

450

Feedback control

Control strategy which is based on the result of the previous run to modify the next run to have better performance.

451

FEOL

Front End-of-Line: the portion of the DRAM fabrication process from blanket silicon to the formation and isolation of the transistors. See also: MOL (Middle-of-Line) and BEOL (Back End-of-Line).

452

FIFO

First In First Out. A process that ensures that older material is used or inspected first.

453

Flipper

This device uses vacuum to grasp the substrate, flips it, and then places it on the saw chuck table. (A Singulation term in Assembly).

454

FMEA

The acronym for Failure Mode and Effect Analysis, a systematic, structured approach to process improvement in the design and process development stage.

455

FOSB

Front Opening Shipping Box - A container used to ship 300 mm wafers.

456

FOUP

Front Opening Unified Pod - A container used to hold and protect up to 25 300mm wafers during storage and transport.

457

Front End Manufacturing

This refers to wafer processing that takes place in the clean room, as opposed to processing that happens after the wafer has been essentially finished. Once the wafer is done with its clean room processing it moves into the back end manufacturing, which

458

Front End Of Line processes, FEOL 

Operations performed on the semiconductor wafer in the course of device manufacturing up to first metallization.

459

GERM

Generic Recipe Manager (GeRM) The Generic Recipe Manager is an engineering software program and database that is used for manufacturing automation. The GeRM program stores recipe information. The program also allows inserting, updating, deleting, and view

460

Gigabyte

GB,gig: This refers to approximately one billion bytes. To be specific, it is 2^30, or 1,073,741,824 bytes.

461

Gripper

In Assembly Trim/Form. A Dusan onload specific device that transports individual leadframes from a magazine to the onload track assembly by way of mechanical or vacuum operation.

462

GDM

GeRM Deviation Management

463

GUI

Graphical User Interface

464

Hazard warning

Any words, picture, symbol, or combination thereof that conveys the hazard of the toxic substance in the container.

465

Hazardous Waste

Any waste material that is deemed unsafe for humans or the environment and requires special disposal procedures.

466

Hot lot

A lot that has priority over other lots in the line and should be processed as soon as possible. Most hot lots will be 'yellow striped,' or some will have 'hot' written on the traveler or lot box.

467

Hold

A process used to set lots aside to be reviewed by a member of leadership, engineering, members of the EDS group, or other support groups.

468

Hold Lots

Lots put on hold for FA (Failure Analysis) or Engineering due to a deviation.

469

I/O port

Connection to a CPU that is configured or programmed to provide data path between the CPU and external devices such as a keyboard, display, or reader; it may be an input port or an output port, or it may be bi-directional.

470

IC

1) Inventory Control 2) Integrated circuit. A tiny complex of electronic components and their connections that is produced in or on a small slice of material (such as silicon).

471

Idle

A piece of equipment not in use.

472

IMFT

Intel/Micron Flash Technologies. IM Flash Technologies is a joint venture between Micron and Intel to manufacture NAND flash memory. See the IMFT website at www.imftech.com.

473

IPQ

Ideal Production Quantity

474

IPR

Initial Production Run.

475

IQ

No of days to complete qual

476

ISO

International Standards Organization.

477

Jigs

A device used to position and hold parts for machining operations and to guide the cutting tool.

478

Kit

A collection of all materials and documentation necessary to complete a production job.

479

Laser scribe

A unique 4 digit mark placed on a component at the assembly step. The scribe identifies the lot from which the component originated.

480

Layout

The screen that shows the arrangement of sections on the machine.

481

LDI

Lot Dispatch Interface

482

LIFO

Last In First Out.

483

Line

Entire process flow.

484

Line yield

The cumulative (overall) yields through all operations of any manufacturing area.

485

LL

Load Lock

486

LLM

Load Lock Module

487

Loadlock

Vacuum chambers, located on either side of the main reaction chamber, which enable the main chamber to remain at a constant vacuum status.

488

Lockout/Tagout

The physical restraint of all hazardous energy sources that supply power to a piece of equipment, machinery or system.

489

Lot

A group of wafers that travels through the processing as a unit in a box marked with an assigned number.

490

Lot Aborted

Lot does not successfully completed process, aka BATCH_ABORT received by host.

491

Lot Committed

Lot track-in to a step upon all carrier objects of a batch are created successfully on the equipment, before PJ and CJ are created.

492

Lot Filter

A field within Factory Works that it utilized to assign and identify different attributes.

493

Lot History

In Factory Works and MAM, Lot History contains a list of activities that have occurred for the lot.

494

Lot ID

A unique number assigned to each direct material inventory based on purchase order number. In Factory Works, a work order in progress.

495

Lot number

A unique number assigned to each direct material inventory based on purchase order number. In Factory Works, a work order in progress.

496

Lot Processed

Lot completed process in equipment, aka BATCH_END event received by host.

497

Lot Running

Lot started processing in equipment, aka BATCH_START event received by host.

498

Lot Staged

Lot staged to an equipment using CimOne300 GUI.

499

Lot traveler

A tag that identifies the lot. Lot travelers travel with the lot through all steps in the area and list the current step and information for the lot.

500

Lot Type

Used to differentiate between Eng/Production/Qual lots.

501

Lot-Ordering

An interface in CimOne GUI for operator to pre-select lot at upstream process step to run at specified downstream process step.

502

LotView

An interface in CIMOne GUI which displays a list of dispatched lots to a specified equipment.

503

LP

Loading Port

504

LPRO

Low Pressure Oxide

505

LPRO Manager

CimCentral application which is used to control the lot to be processed in the online equipments for limited process only

506

Mainframe

Refer to tools that have chambers.

507

Manual mode

In this mode, the machine does not run from a bond program. Manual mode is used to teach master bond parameters that will be used when a bond program is taught in edit mode. Manual mode is used when you need to manually enter information or bond.

508

Manual Port

Input and output ports accessed by operators

509

Manufacturing execution system

A system used to track the execution of the process of manufacturing a semiconductor

510

Material safety data sheet

MSDS, a sheet required by OSHA, and published by the material manufacturer, that provides all of the pertinent information about the safety, health and physical hazards of the substance and how to respond to emergency sit-uations involving exposure to the

511

MATREQ

MATerials REQuisition: A computer program used to request materials.

512

MDM

Micron Document Manager

513

Merge

In Factory Works/SIMS/MAM, this function allows several lots to be combined into a larger lot.

514

MPD

Micron Passdown

515

MT_Groups

Micron Technology Groups

516

MTTF

Mean Time To Failure.

517

MTTR

Mean Time To Repair.

518

MTTR

Mean time to recovery

519

MTTR

Mean Time to Recovery

520

Nand

* A type of flash architecture with the memory array accessed in a vertical manner. Commonly used as storage medium in digital cameras, MP3 players, etc. * Not AND.A Boolean operation which is true unless both of its inputs are true.Another way of

521

Nanotechnology

Nanotechnology: The prefix nano means a billionth. Nanotechnology deals with various structures of matter having dimensions of the order of a billionth of a meter. In the semiconductor industry, it is a branch of engineering that deals with the design of

522

OCM

Outlook Calendar Manager

523

OEM

Acronym for: Original Equipment Manufacturer.

524

Offline

Unable to communicate with host

525

Offline GUI

An interface for operator to enter data to feed machine process data to SMS template, LotViewer and LotHist and perform a manual logout the lot from the current logpoint/Operation. Available on 200mm only

526

OLUS

Operator Load Unload Station - used to dispatch lots for processing and sending lots on after processing.

527

Online-Local

Able to communicate with host, but not able to accept remote commands from host

528

Online-Remote

Able to accept remote commands from host

529

Purchase order

(PO) A customer's commitment to buy goods or services from a supplier.

530

QDR

(Quality Deviation Report) - A report attached to a lot that has deviated from the normal process or that is not within specifications.

531

QDRS

Quality Deviation Report Summary

532

Qual

(Qualification)- the process of checking machine functioning to make ready for product. (Qualification) - The process of checking machines to ensure that they are ready to run product.

533

Qual lot

An experimental lot.

534

Qual lot

Qualification Lot. Lots that are run through a leak test to ensure that machinery in other areas is grounded properly.

535

Qual State

The machine MES state where qual is done.

536

Queue Time

Maximum limit of waiting time after the last processing step to the next step, generally set base on yield loss or inline changes established with the waiting time (equivalent to Time Window in TECH's term).

537

R&D

Research and Development. A department that researches and develops Microns' parts.

538

Radio Frequency Identification (RFID)

A system that consists of a transponder or "tag" {small silicon chips that contain identifying data} and a "reader" that automatically receives and decodes the data on the tag. RFID systems operate in both low frequency {less than 100 megahertz} and high

539

RAM

Random Access Memory. RAM packs millions of data-storing electrical circuits onto a small chip. Devices can write to and read from these storage locations, and the CPU uses this memory to hold programs and data.

540

Ramp up

A gradual consistent increase in production in one or all departments of the company.

541

Range

The difference between the smallest and largest values in a set of data. This is the simplest measure of variation.

542

Reliability

An index of the capability of a device, circuit or system to perform properly for its intended life in its intended environment; continued conformance to specification.

543

Robot arm

A robotic arm that moves the wafers on the tapers, detapers, and ADE.

544

Robot end effecters

The end of the robot arm that holds the wafer.

545

Runahead lot

A lot that runs ahead of of the rest of the product to see if there are any problems in the process line.

546

SAM

The Setup@Micron (SAM) web site provides one central location to view currently installed programs, install workgroup programs - programs used by members in your work area, uninstall programs, search for other programs, and access more information for a p

547

Scanner

1) A machine used to check lead coplinarity. 2) Used to read barcodes and enter the information into an application.

548

Scanner

A laser scanner on the tapers and detapers mounted to the robot arm. It scans the load boats, counts the wafers, determines the position of the wafers, and checks for any cross-slotting.

549

Scrap

* Parts that have failed all tests and are therefore disposed at a low value. * Product that is scrapped falls out of a tracking system. This does not necessarily mean the product is to be ôthrown awayö. Often components that are ôscrappedö in MAM

550

Screamer lot

Priority lot

551

Scribe

A marking on a wafer that identifies the wafer and the lot it came from. The scribe is located on the front of the wafer, opposite the major flat.

552

SEM

Scanning Electron Microscope: is the best known and most widely-used of the surface analytical techniques. High resolution images of surface topography, with excellent depth of field are produced using a highly-focused, scanning (primary) electron beam. T

553

Semiconductor

* A class of materials, such as silicon and germanium, whose electrical properties lie between those of conductors (such as copper and aluminum) and insulators (such as glass and rubber). * A material that exhibits relatively high resistance in a

554

Shift

SPC (Statistical Process Control) term that indicates the process has changed suddenly and is detected by eight consecutive points falling on the same side of the process center line (above or below the mean).

555

Sigma Data Collector

The Sigma Data Collector program is the front-end interface for the Sigma system. This program is used to collect data from existing manufacturing runs, and then send that data to other systems such as MTSPC or MES. The data collected by the Sigma Data Co

556

Sigma Specs

The name of the data collection plan in Sigma.

557

Simga History

Allows viewing of all completed Sigma run historical data using the Sigma History program. The Sigma Data Collector program collects and stores data from Sigma at the completion of a run process. The Sigma History program is the interface used to search f

558

SOP

Standard Operating Procedure.

559

SPC

Statistical Process Control: The use of statistics to determine uniformity around a target value.

560

Stage

The initial step to every process flow. Staging a lot is to assign a lot to the respective equipment (load-port) which the lot will be processed.

561

Staging

On Test Floor, the process of choosing lots according to priority and placing them at each position on the Test Floor in order to keep each system operating with little or no downtime.

562

Status

Indicates if the specific piece of equipment is idle or Busy.

563

STB

Short Term Bonus

564

Step

An operation within the process flow.

565

Stocker

Storage module of AMHS system

566

Stockers

Automated storage units for wafers when they are not being processed.

567

SWR

Special Work Request. Organized by Engineering and used to perform experimental procedures on specific lots as a means to find ways to improve the product. An SWR attached to the lot details what changes are necessary.

568

System

A group of machines combined to operate together, or any tester/handler combination.

569

Targets

A term used to refer to wafers that have been exposed and developed so that alignment and exposure can be checked.

570

TBD

To Be Determined. Used on quotes in reference to shipping dates.

571

TW

Test Wafer

572

User Acceptance Test

The process of testing and verification of the behavior/results of an application code or configuration change. The user who requested for a change or a new development will need to signoff the UAT as passed before the change is promoted to priction statu

573

Utilization

Actual wafer move in a given time.

574

Vacuum

A low-pressure condition.

575

Vehicle

The transport unit for OHS and OHT

576

Wafer

A round slice of silicon on which integrated circuits are constructed; usually anywhere from 75 mm (3") to 300 mm (12")in diameter. Also referred to as substrate.

577

Wafer

Sometimes called a slice. A wafer is a thin, single-crystalline material used to manufacture integrated circuits. Wafers are sliced from a long cylinder of material called a boule. In its pure form, the boule is non-conducting; it is only after it is dope

578

Wafer fab

Site where integrated circuits or devices are manufactured.

579

Wafer fabrication

Process of manufacturing wafers.

580

Wafer ID Selection

To manually select additional wafer ID to be processed other than the pre-selected wafers in GeRM.

581

Wafer map

A wafer map is generated when the dice on a wafer are tested in Probe. This wafer map is sent to a data base in the Vax and is called up by the die attach machine to identify which dice are to be picked for Assembly or die sales.

582

Wafer Scribe

The seven digit number located on the wafer where designated in the Fab. The first number represents the Fab area in which it was processed, the next four digits is the lot number, the last two digits is the wafer number.

583

Wafer sort

The step after wafer fabrication during which the integrated circuits are tested for functionality. Probes contact the pads of the circuit to conduct the test-leading to the name "prober". The equipment that performs electrical tests on each die site of c

584

WIP

Work In Process, starts as Pre-WIP and processed through all the requires steps to Finished Goods.

585

Wip Summary

Reports that is used by the mfg to monitor the Wip movement of the flow

586

Work Constraint report

Reports that is used by the mfg to monitor the most constrained workstation in the fab based on the rank of the workstation. This indicates the amount of time (in days) required to clear out inventory at that workstaion.

587

Work Order

The workflow in the SAP PM module that monitors and tracks the step by step process of carrying out a maintenance on a production equipment. The Work Order is used mainly to trigger and account for materials required for a maintenace job.

588

WW

Work Week: Micron's work week begins Friday morning and ends on Thursday evening.

589

WW

Workweek

590

Yield

The percent of wafers, dice, or packaged units conforming to specifications. The most common yields in the manufacturing process are: wafer fab yield (percentage of the wafers that complete wafer processing); wafer probe yield (the fraction of dice on a w

591

Term

Definition

592

AMAT

Applied Materials

593

AMHS

Automated Material Handling System - used to automatically transport lots from bay to bay or tool to tool.

594

Area

In Factory Works, this identifies a location where the lot is available and ready to be dispatched to specific piece of equipment. EXAMPLE: TEST, MARK/SCAN/Packaging, and Burn.

595

Arms

The moving parts of the taper, detaper, and grinder that handle the wafers or tape.

596

Assembly

The final stage of semiconductor manufacturing in which the wafer is divided into individual units (chips) and placed in a protective package. Steps include probing, dicing, die attach, wire bonding, encapsulation and final test.

597

Auto-Auto Operation

Auto Staging by CIMAssign/CIMStage and Auto Delivery of Lots by AMHS for 300mm operations

598

Back End Manufacturing

The portion of semiconductor manufacturing that happens after the wafer has left the clean room. This includes testing the chips at wafer level, repairing the chips if necessary, dicing the wafers and putting the individual chips into packages. In short,

599

Back End Of Line processes, BEOL

Operations performed on the semiconductor wafer in the course of device manufacturing following first metallization.

600

Back out

A packaged lot or group of packaged lots that have been issued back to Post Electrical from Finished Goods.

601

Back up Lot

A lot that is precounted and ready for test.

602

Backend

The production from Assembly to Shipping.

603

Back-End-Of-Line

Acronym: BEOL; the back end is considered to be all of the process steps from contact through the completion of the wafer prior to electrical test and probe.

604

Batch

A unique identifier for one or more lots that process together in a equipment.

605

Batch

Group of wafers processed together.

606

Boat

A quartz or Teflon structure that holds wafers during transport or processing. Quartz boats are used for processes that require excessive heat because they can withstand the heat and will not contaminate the wafers from melting or changing characteristics

607

Booties

Shoes worn in the Fab.

608

Bucket Report

Reports that is used by the mfg to monitor required equipment capacity

609

Carts

A small wheeled vehicle used to move and temporarily hold component and module lots.

610

Cassette

An open-carrier that holds wafers.

611

CBT

Computer Based Training

612

Cell

A tiny area within the memory array that stores a bit. A cell is actually a small capacitor that stores a bit in the form of a charge.

613

Cell

Established locations in the manufacturing area where similar machines reside.

614

Certification

The achievement of a level of competency on a specific piece of equipment or specific operation.

615

CH

Change Management

616

Chamber

Short for vacuum chamber: a cavity within equipment such as an implanter which resides with reduced pressure and which usually has a specific function, such as the end station or target chamber.

617

CIM

Computer Integrated Manufacturing.

618

CimAssign

Comprises of optimization rule, dispatch rules, sampling rules and assignment rules. Used in 300mm to assign lots to tools.

619

CimCentral

Generic application interface to modify databases. Applications such as Recipe Manager, Limits Manager, Template Manager and CIMConfig are built on top of the CIMCentral generic interface using CIM GUI Builder

620

CimOne

A window application which provides a one-stop interface for fab users to start, retrieve and check lots

621

Cleanroom

The super clean environment in which semiconductors are manufactured. The lower the rating, the cleaner the facility. These rooms typically have hundreds of thousands of particles less per cubic foot than the environment.

622

Contaminant

Foreign material, such as fibers, hair, plastic, etc. that inhibit the end function of a PCA (Printed Circuit Assembly).

623

Contamination

A general term used to describe anything on a PCB (Printed Circuit Board) or component that is not supposed to be there at that point in the process. (e.g., particles, dirt, fingerprints, etc).

624

Cycle purge

To flow high volume of gas and then pump down for a few times (after PM) to get rid of particle.

625

Cycle time

The amount of time it take to process a lot(s) from one step to another.

626

Cycletime

Time taken from start-end.

627

Defect

A flaw in/on a wafer or die, which is an unacceptable condition that does not meet the customer's manufacturing requirements. Any deviation from the normally accepted characteristics of product or component.

628

Delete Step

A CIMOne transaction which skips the lot from the current step to the proceeding step.

629

Documentum

A computer library where documents (such as procedures) are stored.

630

DOE

An acronym for Design of Experiments. Design of Experiment methods are used to improve and optimize processes.

631

DPM

Defects Per Million.

632

DPW

Die Per Wafer.

633

DQDR

Deviation Quality Deviation Report

634

DRAM

Dynamic Random Access Memory. A type of memory component used to store information in a computer system. 'Dynamic' means the DRAMs need a constant 'refresh' (pulse of current through all of the memory cells) to keep the stored information.

635

EMO

Emergency Off Switch.

636

EMO

Emergency Machine Off

637

End user

The ultimate user of the product. The end users of Micron's memory systems are banks, schools, hospitals, etc.

638

Engineering change notice

(ECN) A notification of a change made to inform everyone involved of a change and how it will affect their area.

639

engineering files

Files that ware created at runtime to store engineering data of each process run.

640

Engineering Work

Corrective maintenance work that is performed on AMHS components

641

ERT

Emergency Response Team. A specially-trained team of people who respond to emergencies.

642

ESD

Electrostatic Discharge, The dissipation of electricity. (In layman's terms, a "shock.") ESD can easily destroy semiconductor products, even when the discharge is too small to be felt.

643

ET

Equipment Tracking

644

ETA

Estimated Time of Arrival.

645

ETI

Equipment Tracking Interface: A computer program used for logging equipment to different stages of operation.

646

Event

A particular step in a process on the coat or develop tracks.

647

Fab

(FABrication) The production area of the company where integrated circuitry (die) are formed on bare silicon wafers through various layer formations. The four areas of processing in the Fab are Diffusion, Photo, Etch, and Implant.

648

Fab Out

Wafers finished processing in Fab and passed over to Test.

649

FABNAV

Data Navigator (Software)

650

Feedback control

Control strategy which is based on the result of the previous run to modify the next run to have better performance.

651

FEOL

Front End-of-Line: the portion of the DRAM fabrication process from blanket silicon to the formation and isolation of the transistors. See also: MOL (Middle-of-Line) and BEOL (Back End-of-Line).

652

FIFO

First In First Out. A process that ensures that older material is used or inspected first.

653

Flipper

This device uses vacuum to grasp the substrate, flips it, and then places it on the saw chuck table. (A Singulation term in Assembly).

654

FMEA

The acronym for Failure Mode and Effect Analysis, a systematic, structured approach to process improvement in the design and process development stage.

655

FOSB

Front Opening Shipping Box - A container used to ship 300 mm wafers.

656

FOUP

Front Opening Unified Pod - A container used to hold and protect up to 25 300mm wafers during storage and transport.

657

Front End Manufacturing

This refers to wafer processing that takes place in the clean room, as opposed to processing that happens after the wafer has been essentially finished. Once the wafer is done with its clean room processing it moves into the back end manufacturing, which

658

Front End Of Line processes, FEOL 

Operations performed on the semiconductor wafer in the course of device manufacturing up to first metallization.

659

GERM

Generic Recipe Manager (GeRM) The Generic Recipe Manager is an engineering software program and database that is used for manufacturing automation. The GeRM program stores recipe information. The program also allows inserting, updating, deleting, and view

660

Gigabyte

GB,gig: This refers to approximately one billion bytes. To be specific, it is 2^30, or 1,073,741,824 bytes.

661

Gripper

In Assembly Trim/Form. A Dusan onload specific device that transports individual leadframes from a magazine to the onload track assembly by way of mechanical or vacuum operation.

662

GDM

GeRM Deviation Management

663

GUI

Graphical User Interface

664

Hazard warning

Any words, picture, symbol, or combination thereof that conveys the hazard of the toxic substance in the container.

665

Hazardous Waste

Any waste material that is deemed unsafe for humans or the environment and requires special disposal procedures.

666

Hot lot

A lot that has priority over other lots in the line and should be processed as soon as possible. Most hot lots will be 'yellow striped,' or some will have 'hot' written on the traveler or lot box.

667

Hold

A process used to set lots aside to be reviewed by a member of leadership, engineering, members of the EDS group, or other support groups.

668

Hold Lots

Lots put on hold for FA (Failure Analysis) or Engineering due to a deviation.

669

I/O port

Connection to a CPU that is configured or programmed to provide data path between the CPU and external devices such as a keyboard, display, or reader; it may be an input port or an output port, or it may be bi-directional.

670

IC

1) Inventory Control 2) Integrated circuit. A tiny complex of electronic components and their connections that is produced in or on a small slice of material (such as silicon).

671

Idle

A piece of equipment not in use.

672

IMFT

Intel/Micron Flash Technologies. IM Flash Technologies is a joint venture between Micron and Intel to manufacture NAND flash memory. See the IMFT website at www.imftech.com.

673

IPQ

Ideal Production Quantity

674

IPR

Initial Production Run.

675

IQ

No of days to complete qual

676

ISO

International Standards Organization.

677

Jigs

A device used to position and hold parts for machining operations and to guide the cutting tool.

678

Kit

A collection of all materials and documentation necessary to complete a production job.

679

Laser scribe

A unique 4 digit mark placed on a component at the assembly step. The scribe identifies the lot from which the component originated.

680

Layout

The screen that shows the arrangement of sections on the machine.

681

LDI

Lot Dispatch Interface

682

LIFO

Last In First Out.

683

Line

Entire process flow.

684

Line yield

The cumulative (overall) yields through all operations of any manufacturing area.

685

LL

Load Lock

686

LLM

Load Lock Module

687

Loadlock

Vacuum chambers, located on either side of the main reaction chamber, which enable the main chamber to remain at a constant vacuum status.

688

Lockout/Tagout

The physical restraint of all hazardous energy sources that supply power to a piece of equipment, machinery or system.

689

Lot

A group of wafers that travels through the processing as a unit in a box marked with an assigned number.

690

Lot Aborted

Lot does not successfully completed process, aka BATCH_ABORT received by host.

691

Lot Committed

Lot track-in to a step upon all carrier objects of a batch are created successfully on the equipment, before PJ and CJ are created.

692

Lot Filter

A field within Factory Works that it utilized to assign and identify different attributes.

693

Lot History

In Factory Works and MAM, Lot History contains a list of activities that have occurred for the lot.

694

Lot ID

A unique number assigned to each direct material inventory based on purchase order number. In Factory Works, a work order in progress.

695

Lot number

A unique number assigned to each direct material inventory based on purchase order number. In Factory Works, a work order in progress.

696

Lot Processed

Lot completed process in equipment, aka BATCH_END event received by host.

697

Lot Running

Lot started processing in equipment, aka BATCH_START event received by host.

698

Lot Staged

Lot staged to an equipment using CimOne300 GUI.

699

Lot traveler

A tag that identifies the lot. Lot travelers travel with the lot through all steps in the area and list the current step and information for the lot.

700

Lot Type

Used to differentiate between Eng/Production/Qual lots.

701

Lot-Ordering

An interface in CimOne GUI for operator to pre-select lot at upstream process step to run at specified downstream process step.

702

LotView

An interface in CIMOne GUI which displays a list of dispatched lots to a specified equipment.

703

LP

Loading Port

704

LPRO

Low Pressure Oxide

705

LPRO Manager

CimCentral application which is used to control the lot to be processed in the online equipments for limited process only

706

Mainframe

Refer to tools that have chambers.

707

Manual mode

In this mode, the machine does not run from a bond program. Manual mode is used to teach master bond parameters that will be used when a bond program is taught in edit mode. Manual mode is used when you need to manually enter information or bond.

708

Manual Port

Input and output ports accessed by operators

709

Manufacturing execution system

A system used to track the execution of the process of manufacturing a semiconductor

710

Material safety data sheet

MSDS, a sheet required by OSHA, and published by the material manufacturer, that provides all of the pertinent information about the safety, health and physical hazards of the substance and how to respond to emergency sit-uations involving exposure to the

711

MATREQ

MATerials REQuisition: A computer program used to request materials.

712

MDM

Micron Document Manager

713

Merge

In Factory Works/SIMS/MAM, this function allows several lots to be combined into a larger lot.

714

MPD

Micron Passdown

715

MT_Groups

Micron Technology Groups

716

MTTF

Mean Time To Failure.

717

MTTR

Mean Time To Repair.

718

MTTR

Mean time to recovery

719

MTTR

Mean Time to Recovery

720

Nand

* A type of flash architecture with the memory array accessed in a vertical manner. Commonly used as storage medium in digital cameras, MP3 players, etc. * Not AND.A Boolean operation which is true unless both of its inputs are true.Another way of

721

Nanotechnology

Nanotechnology: The prefix nano means a billionth. Nanotechnology deals with various structures of matter having dimensions of the order of a billionth of a meter. In the semiconductor industry, it is a branch of engineering that deals with the design of

722

OCM

Outlook Calendar Manager

723

OEM

Acronym for: Original Equipment Manufacturer.

724

Offline

Unable to communicate with host

725

Offline GUI

An interface for operator to enter data to feed machine process data to SMS template, LotViewer and LotHist and perform a manual logout the lot from the current logpoint/Operation. Available on 200mm only

726

OLUS

Operator Load Unload Station - used to dispatch lots for processing and sending lots on after processing.

727

Online-Local

Able to communicate with host, but not able to accept remote commands from host

728

Online-Remote

Able to accept remote commands from host

729

Purchase order

(PO) A customer's commitment to buy goods or services from a supplier.

730

QDR

(Quality Deviation Report) - A report attached to a lot that has deviated from the normal process or that is not within specifications.

731

QDRS

Quality Deviation Report Summary

732

Qual

(Qualification)- the process of checking machine functioning to make ready for product. (Qualification) - The process of checking machines to ensure that they are ready to run product.

733

Qual lot

An experimental lot.

734

Qual lot

Qualification Lot. Lots that are run through a leak test to ensure that machinery in other areas is grounded properly.

735

Qual State

The machine MES state where qual is done.

736

Queue Time

Maximum limit of waiting time after the last processing step to the next step, generally set base on yield loss or inline changes established with the waiting time (equivalent to Time Window in TECH's term).

737

R&D

Research and Development. A department that researches and develops Microns' parts.

738

Radio Frequency Identification (RFID)

A system that consists of a transponder or "tag" {small silicon chips that contain identifying data} and a "reader" that automatically receives and decodes the data on the tag. RFID systems operate in both low frequency {less than 100 megahertz} and high

739

RAM

Random Access Memory. RAM packs millions of data-storing electrical circuits onto a small chip. Devices can write to and read from these storage locations, and the CPU uses this memory to hold programs and data.

740

Ramp up

A gradual consistent increase in production in one or all departments of the company.

741

Range

The difference between the smallest and largest values in a set of data. This is the simplest measure of variation.

742

Reliability

An index of the capability of a device, circuit or system to perform properly for its intended life in its intended environment; continued conformance to specification.

743

Robot arm

A robotic arm that moves the wafers on the tapers, detapers, and ADE.

744

Robot end effecters

The end of the robot arm that holds the wafer.

745

Runahead lot

A lot that runs ahead of of the rest of the product to see if there are any problems in the process line.

746

SAM

The Setup@Micron (SAM) web site provides one central location to view currently installed programs, install workgroup programs - programs used by members in your work area, uninstall programs, search for other programs, and access more information for a p

747

Scanner

1) A machine used to check lead coplinarity. 2) Used to read barcodes and enter the information into an application.

748

Scanner

A laser scanner on the tapers and detapers mounted to the robot arm. It scans the load boats, counts the wafers, determines the position of the wafers, and checks for any cross-slotting.

749

Scrap

* Parts that have failed all tests and are therefore disposed at a low value. * Product that is scrapped falls out of a tracking system. This does not necessarily mean the product is to be ôthrown awayö. Often components that are ôscrappedö in MAM

750

Screamer lot

Priority lot

751

Scribe

A marking on a wafer that identifies the wafer and the lot it came from. The scribe is located on the front of the wafer, opposite the major flat.

752

SEM

Scanning Electron Microscope: is the best known and most widely-used of the surface analytical techniques. High resolution images of surface topography, with excellent depth of field are produced using a highly-focused, scanning (primary) electron beam. T

753

Semiconductor

* A class of materials, such as silicon and germanium, whose electrical properties lie between those of conductors (such as copper and aluminum) and insulators (such as glass and rubber). * A material that exhibits relatively high resistance in a

754

Shift

SPC (Statistical Process Control) term that indicates the process has changed suddenly and is detected by eight consecutive points falling on the same side of the process center line (above or below the mean).

755

Sigma Data Collector

The Sigma Data Collector program is the front-end interface for the Sigma system. This program is used to collect data from existing manufacturing runs, and then send that data to other systems such as MTSPC or MES. The data collected by the Sigma Data Co

756

Sigma Specs

The name of the data collection plan in Sigma.

757

Simga History

Allows viewing of all completed Sigma run historical data using the Sigma History program. The Sigma Data Collector program collects and stores data from Sigma at the completion of a run process. The Sigma History program is the interface used to search f

758

SOP

Standard Operating Procedure.

759

SPC

Statistical Process Control: The use of statistics to determine uniformity around a target value.

760

Stage

The initial step to every process flow. Staging a lot is to assign a lot to the respective equipment (load-port) which the lot will be processed.

761

Staging

On Test Floor, the process of choosing lots according to priority and placing them at each position on the Test Floor in order to keep each system operating with little or no downtime.

762

Status

Indicates if the specific piece of equipment is idle or Busy.

763

STB

Short Term Bonus

764

Step

An operation within the process flow.

765

Stocker

Storage module of AMHS system

766

Stockers

Automated storage units for wafers when they are not being processed.

767

SWR

Special Work Request. Organized by Engineering and used to perform experimental procedures on specific lots as a means to find ways to improve the product. An SWR attached to the lot details what changes are necessary.

768

System

A group of machines combined to operate together, or any tester/handler combination.

769

Targets

A term used to refer to wafers that have been exposed and developed so that alignment and exposure can be checked.

770

TBD

To Be Determined. Used on quotes in reference to shipping dates.

771

TW

Test Wafer

772

User Acceptance Test

The process of testing and verification of the behavior/results of an application code or configuration change. The user who requested for a change or a new development will need to signoff the UAT as passed before the change is promoted to priction statu

773

Utilization

Actual wafer move in a given time.

774

Vacuum

A low-pressure condition.

775

Vehicle

The transport unit for OHS and OHT

776

Wafer

A round slice of silicon on which integrated circuits are constructed; usually anywhere from 75 mm (3") to 300 mm (12")in diameter. Also referred to as substrate.

777

Wafer

Sometimes called a slice. A wafer is a thin, single-crystalline material used to manufacture integrated circuits. Wafers are sliced from a long cylinder of material called a boule. In its pure form, the boule is non-conducting; it is only after it is dope

778

Wafer fab

Site where integrated circuits or devices are manufactured.

779

Wafer fabrication

Process of manufacturing wafers.

780

Wafer ID Selection

To manually select additional wafer ID to be processed other than the pre-selected wafers in GeRM.

781

Wafer map

A wafer map is generated when the dice on a wafer are tested in Probe. This wafer map is sent to a data base in the Vax and is called up by the die attach machine to identify which dice are to be picked for Assembly or die sales.

782

Wafer Scribe

The seven digit number located on the wafer where designated in the Fab. The first number represents the Fab area in which it was processed, the next four digits is the lot number, the last two digits is the wafer number.

783

Wafer sort

The step after wafer fabrication during which the integrated circuits are tested for functionality. Probes contact the pads of the circuit to conduct the test-leading to the name "prober". The equipment that performs electrical tests on each die site of c

784

WIP

Work In Process, starts as Pre-WIP and processed through all the requires steps to Finished Goods.

785

Wip Summary

Reports that is used by the mfg to monitor the Wip movement of the flow

786

Work Constraint report

Reports that is used by the mfg to monitor the most constrained workstation in the fab based on the rank of the workstation. This indicates the amount of time (in days) required to clear out inventory at that workstaion.

787

Work Order

The workflow in the SAP PM module that monitors and tracks the step by step process of carrying out a maintenance on a production equipment. The Work Order is used mainly to trigger and account for materials required for a maintenace job.

788

WW

Work Week: Micron's work week begins Friday morning and ends on Thursday evening.

789

WW

Workweek

790

Yield

The percent of wafers, dice, or packaged units conforming to specifications. The most common yields in the manufacturing process are: wafer fab yield (percentage of the wafers that complete wafer processing); wafer probe yield (the fraction of dice on a w

791

Term

Definition

792

AMAT

Applied Materials

793

AMHS

Automated Material Handling System - used to automatically transport lots from bay to bay or tool to tool.

794

Area

In Factory Works, this identifies a location where the lot is available and ready to be dispatched to specific piece of equipment. EXAMPLE: TEST, MARK/SCAN/Packaging, and Burn.

795

Arms

The moving parts of the taper, detaper, and grinder that handle the wafers or tape.

796

Assembly

The final stage of semiconductor manufacturing in which the wafer is divided into individual units (chips) and placed in a protective package. Steps include probing, dicing, die attach, wire bonding, encapsulation and final test.

797

Auto-Auto Operation

Auto Staging by CIMAssign/CIMStage and Auto Delivery of Lots by AMHS for 300mm operations

798

Back End Manufacturing

The portion of semiconductor manufacturing that happens after the wafer has left the clean room. This includes testing the chips at wafer level, repairing the chips if necessary, dicing the wafers and putting the individual chips into packages. In short,

799

Back End Of Line processes, BEOL

Operations performed on the semiconductor wafer in the course of device manufacturing following first metallization.

800

Back out

A packaged lot or group of packaged lots that have been issued back to Post Electrical from Finished Goods.

801

Back up Lot

A lot that is precounted and ready for test.

802

Backend

The production from Assembly to Shipping.

803

Back-End-Of-Line

Acronym: BEOL; the back end is considered to be all of the process steps from contact through the completion of the wafer prior to electrical test and probe.

804

Batch

A unique identifier for one or more lots that process together in a equipment.

805

Batch

Group of wafers processed together.

806

Boat

A quartz or Teflon structure that holds wafers during transport or processing. Quartz boats are used for processes that require excessive heat because they can withstand the heat and will not contaminate the wafers from melting or changing characteristics

807

Booties

Shoes worn in the Fab.

808

Bucket Report

Reports that is used by the mfg to monitor required equipment capacity

809

Carts

A small wheeled vehicle used to move and temporarily hold component and module lots.

810

Cassette

An open-carrier that holds wafers.

811

CBT

Computer Based Training

812

Cell

A tiny area within the memory array that stores a bit. A cell is actually a small capacitor that stores a bit in the form of a charge.

813

Cell

Established locations in the manufacturing area where similar machines reside.

814

Certification

The achievement of a level of competency on a specific piece of equipment or specific operation.

815

CH

Change Management

816

Chamber

Short for vacuum chamber: a cavity within equipment such as an implanter which resides with reduced pressure and which usually has a specific function, such as the end station or target chamber.

817

CIM

Computer Integrated Manufacturing.

818

CimAssign

Comprises of optimization rule, dispatch rules, sampling rules and assignment rules. Used in 300mm to assign lots to tools.

819

CimCentral

Generic application interface to modify databases. Applications such as Recipe Manager, Limits Manager, Template Manager and CIMConfig are built on top of the CIMCentral generic interface using CIM GUI Builder

820

CimOne

A window application which provides a one-stop interface for fab users to start, retrieve and check lots

821

Cleanroom

The super clean environment in which semiconductors are manufactured. The lower the rating, the cleaner the facility. These rooms typically have hundreds of thousands of particles less per cubic foot than the environment.

822

Contaminant

Foreign material, such as fibers, hair, plastic, etc. that inhibit the end function of a PCA (Printed Circuit Assembly).

823

Contamination

A general term used to describe anything on a PCB (Printed Circuit Board) or component that is not supposed to be there at that point in the process. (e.g., particles, dirt, fingerprints, etc).

824

Cycle purge

To flow high volume of gas and then pump down for a few times (after PM) to get rid of particle.

825

Cycle time

The amount of time it take to process a lot(s) from one step to another.

826

Cycletime

Time taken from start-end.

827

Defect

A flaw in/on a wafer or die, which is an unacceptable condition that does not meet the customer's manufacturing requirements. Any deviation from the normally accepted characteristics of product or component.

828

Delete Step

A CIMOne transaction which skips the lot from the current step to the proceeding step.

829

Documentum

A computer library where documents (such as procedures) are stored.

830

DOE

An acronym for Design of Experiments. Design of Experiment methods are used to improve and optimize processes.

831

DPM

Defects Per Million.

832

DPW

Die Per Wafer.

833

DQDR

Deviation Quality Deviation Report

834

DRAM

Dynamic Random Access Memory. A type of memory component used to store information in a computer system. 'Dynamic' means the DRAMs need a constant 'refresh' (pulse of current through all of the memory cells) to keep the stored information.

835

EMO

Emergency Off Switch.

836

EMO

Emergency Machine Off

837

End user

The ultimate user of the product. The end users of Micron's memory systems are banks, schools, hospitals, etc.

838

Engineering change notice

(ECN) A notification of a change made to inform everyone involved of a change and how it will affect their area.

839

engineering files

Files that ware created at runtime to store engineering data of each process run.

840

Engineering Work

Corrective maintenance work that is performed on AMHS components

841

ERT

Emergency Response Team. A specially-trained team of people who respond to emergencies.

842

ESD

Electrostatic Discharge, The dissipation of electricity. (In layman's terms, a "shock.") ESD can easily destroy semiconductor products, even when the discharge is too small to be felt.

843

ET

Equipment Tracking

844

ETA

Estimated Time of Arrival.

845

ETI

Equipment Tracking Interface: A computer program used for logging equipment to different stages of operation.

846

Event

A particular step in a process on the coat or develop tracks.

847

Fab

(FABrication) The production area of the company where integrated circuitry (die) are formed on bare silicon wafers through various layer formations. The four areas of processing in the Fab are Diffusion, Photo, Etch, and Implant.

848

Fab Out

Wafers finished processing in Fab and passed over to Test.

849

FABNAV

Data Navigator (Software)

850

Feedback control

Control strategy which is based on the result of the previous run to modify the next run to have better performance.

851

FEOL

Front End-of-Line: the portion of the DRAM fabrication process from blanket silicon to the formation and isolation of the transistors. See also: MOL (Middle-of-Line) and BEOL (Back End-of-Line).

852

FIFO

First In First Out. A process that ensures that older material is used or inspected first.

853

Flipper

This device uses vacuum to grasp the substrate, flips it, and then places it on the saw chuck table. (A Singulation term in Assembly).

854

FMEA

The acronym for Failure Mode and Effect Analysis, a systematic, structured approach to process improvement in the design and process development stage.

855

FOSB

Front Opening Shipping Box - A container used to ship 300 mm wafers.

856

FOUP

Front Opening Unified Pod - A container used to hold and protect up to 25 300mm wafers during storage and transport.

857

Front End Manufacturing

This refers to wafer processing that takes place in the clean room, as opposed to processing that happens after the wafer has been essentially finished. Once the wafer is done with its clean room processing it moves into the back end manufacturing, which

858

Front End Of Line processes, FEOL 

Operations performed on the semiconductor wafer in the course of device manufacturing up to first metallization.

859

GERM

Generic Recipe Manager (GeRM) The Generic Recipe Manager is an engineering software program and database that is used for manufacturing automation. The GeRM program stores recipe information. The program also allows inserting, updating, deleting, and view

860

Gigabyte

GB,gig: This refers to approximately one billion bytes. To be specific, it is 2^30, or 1,073,741,824 bytes.

861

Gripper

In Assembly Trim/Form. A Dusan onload specific device that transports individual leadframes from a magazine to the onload track assembly by way of mechanical or vacuum operation.

862

GDM

GeRM Deviation Management

863

GUI

Graphical User Interface

864

Hazard warning

Any words, picture, symbol, or combination thereof that conveys the hazard of the toxic substance in the container.

865

Hazardous Waste

Any waste material that is deemed unsafe for humans or the environment and requires special disposal procedures.

866

Hot lot

A lot that has priority over other lots in the line and should be processed as soon as possible. Most hot lots will be 'yellow striped,' or some will have 'hot' written on the traveler or lot box.

867

Hold

A process used to set lots aside to be reviewed by a member of leadership, engineering, members of the EDS group, or other support groups.

868

Hold Lots

Lots put on hold for FA (Failure Analysis) or Engineering due to a deviation.

869

I/O port

Connection to a CPU that is configured or programmed to provide data path between the CPU and external devices such as a keyboard, display, or reader; it may be an input port or an output port, or it may be bi-directional.

870

IC

1) Inventory Control 2) Integrated circuit. A tiny complex of electronic components and their connections that is produced in or on a small slice of material (such as silicon).

871

Idle

A piece of equipment not in use.

872

IMFT

Intel/Micron Flash Technologies. IM Flash Technologies is a joint venture between Micron and Intel to manufacture NAND flash memory. See the IMFT website at www.imftech.com.

873

IPQ

Ideal Production Quantity

874

IPR

Initial Production Run.

875

IQ

No of days to complete qual

876

ISO

International Standards Organization.

877

Jigs

A device used to position and hold parts for machining operations and to guide the cutting tool.

878

Kit

A collection of all materials and documentation necessary to complete a production job.

879

Laser scribe

A unique 4 digit mark placed on a component at the assembly step. The scribe identifies the lot from which the component originated.

880

Layout

The screen that shows the arrangement of sections on the machine.

881

LDI

Lot Dispatch Interface

882

LIFO

Last In First Out.

883

Line

Entire process flow.

884

Line yield

The cumulative (overall) yields through all operations of any manufacturing area.

885

LL

Load Lock

886

LLM

Load Lock Module

887

Loadlock

Vacuum chambers, located on either side of the main reaction chamber, which enable the main chamber to remain at a constant vacuum status.

888

Lockout/Tagout

The physical restraint of all hazardous energy sources that supply power to a piece of equipment, machinery or system.

889

Lot

A group of wafers that travels through the processing as a unit in a box marked with an assigned number.

890

Lot Aborted

Lot does not successfully completed process, aka BATCH_ABORT received by host.

891

Lot Committed

Lot track-in to a step upon all carrier objects of a batch are created successfully on the equipment, before PJ and CJ are created.

892

Lot Filter

A field within Factory Works that it utilized to assign and identify different attributes.

893

Lot History

In Factory Works and MAM, Lot History contains a list of activities that have occurred for the lot.

894

Lot ID

A unique number assigned to each direct material inventory based on purchase order number. In Factory Works, a work order in progress.

895

Lot number

A unique number assigned to each direct material inventory based on purchase order number. In Factory Works, a work order in progress.

896

Lot Processed

Lot completed process in equipment, aka BATCH_END event received by host.

897

Lot Running

Lot started processing in equipment, aka BATCH_START event received by host.

898

Lot Staged

Lot staged to an equipment using CimOne300 GUI.

899

Lot traveler

A tag that identifies the lot. Lot travelers travel with the lot through all steps in the area and list the current step and information for the lot.

900

Lot Type

Used to differentiate between Eng/Production/Qual lots.

901

Lot-Ordering

An interface in CimOne GUI for operator to pre-select lot at upstream process step to run at specified downstream process step.

902

LotView

An interface in CIMOne GUI which displays a list of dispatched lots to a specified equipment.

903

LP

Loading Port

904

LPRO

Low Pressure Oxide

905

LPRO Manager

CimCentral application which is used to control the lot to be processed in the online equipments for limited process only

906

Mainframe

Refer to tools that have chambers.

907

Manual mode

In this mode, the machine does not run from a bond program. Manual mode is used to teach master bond parameters that will be used when a bond program is taught in edit mode. Manual mode is used when you need to manually enter information or bond.

908

Manual Port

Input and output ports accessed by operators

909

Manufacturing execution system

A system used to track the execution of the process of manufacturing a semiconductor

910

Material safety data sheet

MSDS, a sheet required by OSHA, and published by the material manufacturer, that provides all of the pertinent information about the safety, health and physical hazards of the substance and how to respond to emergency sit-uations involving exposure to the

911

MATREQ

MATerials REQuisition: A computer program used to request materials.

912

MDM

Micron Document Manager

913

Merge

In Factory Works/SIMS/MAM, this function allows several lots to be combined into a larger lot.

914

MPD

Micron Passdown

915

MT_Groups

Micron Technology Groups

916

MTTF

Mean Time To Failure.

917

MTTR

Mean Time To Repair.

918

MTTR

Mean time to recovery

919

MTTR

Mean Time to Recovery

920

Nand

* A type of flash architecture with the memory array accessed in a vertical manner. Commonly used as storage medium in digital cameras, MP3 players, etc. * Not AND.A Boolean operation which is true unless both of its inputs are true.Another way of

921

Nanotechnology

Nanotechnology: The prefix nano means a billionth. Nanotechnology deals with various structures of matter having dimensions of the order of a billionth of a meter. In the semiconductor industry, it is a branch of engineering that deals with the design of

922

OCM

Outlook Calendar Manager

923

OEM

Acronym for: Original Equipment Manufacturer.

924

Offline

Unable to communicate with host

925

Offline GUI

An interface for operator to enter data to feed machine process data to SMS template, LotViewer and LotHist and perform a manual logout the lot from the current logpoint/Operation. Available on 200mm only

926

OLUS

Operator Load Unload Station - used to dispatch lots for processing and sending lots on after processing.

927

Online-Local

Able to communicate with host, but not able to accept remote commands from host

928

Online-Remote

Able to accept remote commands from host

929

Purchase order

(PO) A customer's commitment to buy goods or services from a supplier.

930

QDR

(Quality Deviation Report) - A report attached to a lot that has deviated from the normal process or that is not within specifications.

931

QDRS

Quality Deviation Report Summary

932

Qual

(Qualification)- the process of checking machine functioning to make ready for product. (Qualification) - The process of checking machines to ensure that they are ready to run product.

933

Qual lot

An experimental lot.

934

Qual lot

Qualification Lot. Lots that are run through a leak test to ensure that machinery in other areas is grounded properly.

935

Qual State

The machine MES state where qual is done.

936

Queue Time

Maximum limit of waiting time after the last processing step to the next step, generally set base on yield loss or inline changes established with the waiting time (equivalent to Time Window in TECH's term).

937

R&D

Research and Development. A department that researches and develops Microns' parts.

938

Radio Frequency Identification (RFID)

A system that consists of a transponder or "tag" {small silicon chips that contain identifying data} and a "reader" that automatically receives and decodes the data on the tag. RFID systems operate in both low frequency {less than 100 megahertz} and high

939

RAM

Random Access Memory. RAM packs millions of data-storing electrical circuits onto a small chip. Devices can write to and read from these storage locations, and the CPU uses this memory to hold programs and data.

940

Ramp up

A gradual consistent increase in production in one or all departments of the company.

941

Range

The difference between the smallest and largest values in a set of data. This is the simplest measure of variation.

942

Reliability

An index of the capability of a device, circuit or system to perform properly for its intended life in its intended environment; continued conformance to specification.

943

Robot arm

A robotic arm that moves the wafers on the tapers, detapers, and ADE.

944

Robot end effecters

The end of the robot arm that holds the wafer.

945

Runahead lot

A lot that runs ahead of of the rest of the product to see if there are any problems in the process line.

946

SAM

The Setup@Micron (SAM) web site provides one central location to view currently installed programs, install workgroup programs - programs used by members in your work area, uninstall programs, search for other programs, and access more information for a p

947

Scanner

1) A machine used to check lead coplinarity. 2) Used to read barcodes and enter the information into an application.

948

Scanner

A laser scanner on the tapers and detapers mounted to the robot arm. It scans the load boats, counts the wafers, determines the position of the wafers, and checks for any cross-slotting.

949

Scrap

* Parts that have failed all tests and are therefore disposed at a low value. * Product that is scrapped falls out of a tracking system. This does not necessarily mean the product is to be ôthrown awayö. Often components that are ôscrappedö in MAM

950

Screamer lot

Priority lot

951

Scribe

A marking on a wafer that identifies the wafer and the lot it came from. The scribe is located on the front of the wafer, opposite the major flat.

952

SEM

Scanning Electron Microscope: is the best known and most widely-used of the surface analytical techniques. High resolution images of surface topography, with excellent depth of field are produced using a highly-focused, scanning (primary) electron beam. T

953

Semiconductor

* A class of materials, such as silicon and germanium, whose electrical properties lie between those of conductors (such as copper and aluminum) and insulators (such as glass and rubber). * A material that exhibits relatively high resistance in a

954

Shift

SPC (Statistical Process Control) term that indicates the process has changed suddenly and is detected by eight consecutive points falling on the same side of the process center line (above or below the mean).

955

Sigma Data Collector

The Sigma Data Collector program is the front-end interface for the Sigma system. This program is used to collect data from existing manufacturing runs, and then send that data to other systems such as MTSPC or MES. The data collected by the Sigma Data Co

956

Sigma Specs

The name of the data collection plan in Sigma.

957

Simga History

Allows viewing of all completed Sigma run historical data using the Sigma History program. The Sigma Data Collector program collects and stores data from Sigma at the completion of a run process. The Sigma History program is the interface used to search f

958

SOP

Standard Operating Procedure.

959

SPC

Statistical Process Control: The use of statistics to determine uniformity around a target value.

960

Stage

The initial step to every process flow. Staging a lot is to assign a lot to the respective equipment (load-port) which the lot will be processed.

961

Staging

On Test Floor, the process of choosing lots according to priority and placing them at each position on the Test Floor in order to keep each system operating with little or no downtime.

962

Status

Indicates if the specific piece of equipment is idle or Busy.

963

STB

Short Term Bonus

964

Step

An operation within the process flow.

965

Stocker

Storage module of AMHS system

966

Stockers

Automated storage units for wafers when they are not being processed.

967

SWR

Special Work Request. Organized by Engineering and used to perform experimental procedures on specific lots as a means to find ways to improve the product. An SWR attached to the lot details what changes are necessary.

968

System

A group of machines combined to operate together, or any tester/handler combination.

969

Targets

A term used to refer to wafers that have been exposed and developed so that alignment and exposure can be checked.

970

TBD

To Be Determined. Used on quotes in reference to shipping dates.

971

TW

Test Wafer

972

User Acceptance Test

The process of testing and verification of the behavior/results of an application code or configuration change. The user who requested for a change or a new development will need to signoff the UAT as passed before the change is promoted to priction statu

973

Utilization

Actual wafer move in a given time.

974

Vacuum

A low-pressure condition.

975

Vehicle

The transport unit for OHS and OHT

976

Wafer

A round slice of silicon on which integrated circuits are constructed; usually anywhere from 75 mm (3") to 300 mm (12")in diameter. Also referred to as substrate.

977

Wafer

Sometimes called a slice. A wafer is a thin, single-crystalline material used to manufacture integrated circuits. Wafers are sliced from a long cylinder of material called a boule. In its pure form, the boule is non-conducting; it is only after it is dope

978

Wafer fab

Site where integrated circuits or devices are manufactured.

979

Wafer fabrication

Process of manufacturing wafers.

980

Wafer ID Selection

To manually select additional wafer ID to be processed other than the pre-selected wafers in GeRM.

981

Wafer map

A wafer map is generated when the dice on a wafer are tested in Probe. This wafer map is sent to a data base in the Vax and is called up by the die attach machine to identify which dice are to be picked for Assembly or die sales.

982

Wafer Scribe

The seven digit number located on the wafer where designated in the Fab. The first number represents the Fab area in which it was processed, the next four digits is the lot number, the last two digits is the wafer number.

983

Wafer sort

The step after wafer fabrication during which the integrated circuits are tested for functionality. Probes contact the pads of the circuit to conduct the test-leading to the name "prober". The equipment that performs electrical tests on each die site of c

984

WIP

Work In Process, starts as Pre-WIP and processed through all the requires steps to Finished Goods.

985

Wip Summary

Reports that is used by the mfg to monitor the Wip movement of the flow

986

Work Constraint report

Reports that is used by the mfg to monitor the most constrained workstation in the fab based on the rank of the workstation. This indicates the amount of time (in days) required to clear out inventory at that workstaion.

987

Work Order

The workflow in the SAP PM module that monitors and tracks the step by step process of carrying out a maintenance on a production equipment. The Work Order is used mainly to trigger and account for materials required for a maintenace job.

988

WW

Work Week: Micron's work week begins Friday morning and ends on Thursday evening.

989

WW

Workweek

990

Yield

The percent of wafers, dice, or packaged units conforming to specifications. The most common yields in the manufacturing process are: wafer fab yield (percentage of the wafers that complete wafer processing); wafer probe yield (the fraction of dice on a w

991

Term

Definition

992

AMAT

Applied Materials

993

AMHS

Automated Material Handling System - used to automatically transport lots from bay to bay or tool to tool.

994

Area

In Factory Works, this identifies a location where the lot is available and ready to be dispatched to specific piece of equipment. EXAMPLE: TEST, MARK/SCAN/Packaging, and Burn.

995

Arms

The moving parts of the taper, detaper, and grinder that handle the wafers or tape.

996

Assembly

The final stage of semiconductor manufacturing in which the wafer is divided into individual units (chips) and placed in a protective package. Steps include probing, dicing, die attach, wire bonding, encapsulation and final test.

997

Auto-Auto Operation

Auto Staging by CIMAssign/CIMStage and Auto Delivery of Lots by AMHS for 300mm operations

998

Back End Manufacturing

The portion of semiconductor manufacturing that happens after the wafer has left the clean room. This includes testing the chips at wafer level, repairing the chips if necessary, dicing the wafers and putting the individual chips into packages. In short,

999

Back End Of Line processes, BEOL

Operations performed on the semiconductor wafer in the course of device manufacturing following first metallization.

1000

Back out

A packaged lot or group of packaged lots that have been issued back to Post Electrical from Finished Goods.

1001

Back up Lot

A lot that is precounted and ready for test.

1002

Backend

The production from Assembly to Shipping.

1003

Back-End-Of-Line

Acronym: BEOL; the back end is considered to be all of the process steps from contact through the completion of the wafer prior to electrical test and probe.

1004

Batch

A unique identifier for one or more lots that process together in a equipment.

1005

Batch

Group of wafers processed together.

1006

Boat

A quartz or Teflon structure that holds wafers during transport or processing. Quartz boats are used for processes that require excessive heat because they can withstand the heat and will not contaminate the wafers from melting or changing characteristics

1007

Booties

Shoes worn in the Fab.

1008

Bucket Report

Reports that is used by the mfg to monitor required equipment capacity

1009

Carts

A small wheeled vehicle used to move and temporarily hold component and module lots.

1010

Cassette

An open-carrier that holds wafers.

1011

CBT

Computer Based Training

1012

Cell

A tiny area within the memory array that stores a bit. A cell is actually a small capacitor that stores a bit in the form of a charge.

1013

Cell

Established locations in the manufacturing area where similar machines reside.

1014

Certification

The achievement of a level of competency on a specific piece of equipment or specific operation.

1015

CH

Change Management

1016

Chamber

Short for vacuum chamber: a cavity within equipment such as an implanter which resides with reduced pressure and which usually has a specific function, such as the end station or target chamber.

1017

CIM

Computer Integrated Manufacturing.

1018

CimAssign

Comprises of optimization rule, dispatch rules, sampling rules and assignment rules. Used in 300mm to assign lots to tools.

1019

CimCentral

Generic application interface to modify databases. Applications such as Recipe Manager, Limits Manager, Template Manager and CIMConfig are built on top of the CIMCentral generic interface using CIM GUI Builder

1020

CimOne

A window application which provides a one-stop interface for fab users to start, retrieve and check lots

1021

Cleanroom

The super clean environment in which semiconductors are manufactured. The lower the rating, the cleaner the facility. These rooms typically have hundreds of thousands of particles less per cubic foot than the environment.

1022

Contaminant

Foreign material, such as fibers, hair, plastic, etc. that inhibit the end function of a PCA (Printed Circuit Assembly).

1023

Contamination

A general term used to describe anything on a PCB (Printed Circuit Board) or component that is not supposed to be there at that point in the process. (e.g., particles, dirt, fingerprints, etc).

1024

Cycle purge

To flow high volume of gas and then pump down for a few times (after PM) to get rid of particle.

1025

Cycle time

The amount of time it take to process a lot(s) from one step to another.

1026

Cycletime

Time taken from start-end.

1027

Defect

A flaw in/on a wafer or die, which is an unacceptable condition that does not meet the customer's manufacturing requirements. Any deviation from the normally accepted characteristics of product or component.

1028

Delete Step

A CIMOne transaction which skips the lot from the current step to the proceeding step.

1029

Documentum

A computer library where documents (such as procedures) are stored.

1030

DOE

An acronym for Design of Experiments. Design of Experiment methods are used to improve and optimize processes.

1031

DPM

Defects Per Million.

1032

DPW

Die Per Wafer.

1033

DQDR

Deviation Quality Deviation Report

1034

DRAM

Dynamic Random Access Memory. A type of memory component used to store information in a computer system. 'Dynamic' means the DRAMs need a constant 'refresh' (pulse of current through all of the memory cells) to keep the stored information.

1035

EMO

Emergency Off Switch.

1036

EMO

Emergency Machine Off

1037

End user

The ultimate user of the product. The end users of Micron's memory systems are banks, schools, hospitals, etc.

1038

Engineering change notice

(ECN) A notification of a change made to inform everyone involved of a change and how it will affect their area.

1039

engineering files

Files that ware created at runtime to store engineering data of each process run.

1040

Engineering Work

Corrective maintenance work that is performed on AMHS components

1041

ERT

Emergency Response Team. A specially-trained team of people who respond to emergencies.

1042

ESD

Electrostatic Discharge, The dissipation of electricity. (In layman's terms, a "shock.") ESD can easily destroy semiconductor products, even when the discharge is too small to be felt.

1043

ET

Equipment Tracking

1044

ETA

Estimated Time of Arrival.

1045

ETI

Equipment Tracking Interface: A computer program used for logging equipment to different stages of operation.

1046

Event

A particular step in a process on the coat or develop tracks.

1047

Fab

(FABrication) The production area of the company where integrated circuitry (die) are formed on bare silicon wafers through various layer formations. The four areas of processing in the Fab are Diffusion, Photo, Etch, and Implant.

1048

Fab Out

Wafers finished processing in Fab and passed over to Test.

1049

FABNAV

Data Navigator (Software)

1050

Feedback control

Control strategy which is based on the result of the previous run to modify the next run to have better performance.

1051

FEOL

Front End-of-Line: the portion of the DRAM fabrication process from blanket silicon to the formation and isolation of the transistors. See also: MOL (Middle-of-Line) and BEOL (Back End-of-Line).

1052

FIFO

First In First Out. A process that ensures that older material is used or inspected first.

1053

Flipper

This device uses vacuum to grasp the substrate, flips it, and then places it on the saw chuck table. (A Singulation term in Assembly).

1054

FMEA

The acronym for Failure Mode and Effect Analysis, a systematic, structured approach to process improvement in the design and process development stage.

1055

FOSB

Front Opening Shipping Box - A container used to ship 300 mm wafers.

1056

FOUP